Led Array

• US 20080061717A1
• Filed: 09/09/2005
• Published: 03/13/2008
• Est. Priority Date: 09/30/2004
• Status: Abandoned Application

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Bogner, Georg, Hofmann, Markus, Reill, Joachim, Reiners, Thomas, Engl, Moritz
• Application Number:
  US11/575,899
• Publication Number:
  US 20080061717A1
• Time in Patent Office: Days
• US Class Current: 315/309
• CPC Class Codes: B60Q 1/0023 the element being a sensor, e.g. distance sensor, camera
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05B 45/18 using temperature feedback
• CPC Class Codes: H05B 45/28 using temperature feedback
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

An LED array comprising at least two LED chips (2) contains a temperature sensor (3), and means are provided for regulating the operating current of the LED chips (2) as a function of the temperature detected by the temperature sensor (3). This makes it possible for the LED chips (2) to be operated for long periods at high operating current, thereby reducing the risk of thermal overload.

Claims

1. An LED array comprising at least two LED chips, wherein-said LED array contains a temperature sensor, and means are provided for regulating an operating current of said LED chips as a function of the temperature detected by said temperature sensor.

2. The LED array as in claim 1, wherein-said LED array includes a chip carrier on which said LED chips are disposed, and said temperature sensor is attached to said chip carrier.

3. The LED array as in claim 2, wherein-said temperature sensor is printed onto said chip carrier.

4. The LED array as in claim 1, wherein said LED array includes a chip carrier on which said LED chips are disposed, said chip carrier being mounted on a carrier body and said temperature sensor being attached to said carrier body.

5. The LED array as in claim 4, wherein said carrier body has a base area of 300 mm² or less.

6. The LED array as in claim 2, wherein said chip carrier has a base area of 300 mm² or less.

7. The LED array as in claim 2, wherein said chip carrier contains a ceramic.

8. The LED array as in claim 1, wherein the distance between at least one of said LED chips and said temperature sensor is 5 mm or less.

9. The LED array as in claim 1, wherein said LED chips of said LED array have no LED housing.

10. The LED arrays as in claim 1, wherein said temperature sensor is a thermocouple.

11. The LED array as in claim 1, wherein said temperature sensor is a temperature-dependent resistor.

12. The LED array as in claim 1, wherein said temperature sensor is a semiconductor component.

13. The LED array as in claim 1, wherein said LED array contains at least four LED chips.

14. The LED array as in claim 1, wherein said LED array comprises an optical element for beam-shaping the radiation emitted by said LED chips.

15. The LED array as in claim 14, wherein said optical element is a CPC-, CEC- or CHC-type optical concentrator.

16. The LED array as in claim 1, wherein said LED array is part of a motor vehicle headlight.

17. The LED array as in claim 3 wherein said chip carrier has a base area of 300 mm² or less.

18. The LED array as in claim 4 wherein said chip carrier has a base area of 300 mm² or less.

19. The LED array as in claim 5 wherein said chip carrier has a base area of 300 mm² or less.

20. The LED array as in claim 4, wherein said chip carrier contains a ceramic.