Semiconductor switching module optimized for resistance to short circuits

• US 20080061912A1
• Filed: 09/04/2007
• Published: 03/13/2008
• Est. Priority Date: 09/08/2006
• Status: Active Grant

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Viala, Bertrand, Meier, Markus, Jonas, Stephan
• Granted Patent: US 8,093,975 B2
• Time in Patent Office: Days
• US Class Current: 335/202
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars

Abstract

A semiconductor switching module is disclosed, including a housing, the housing having openings to carry away pressure which occurs in the case of a short circuit. In at least one embodiment, the semiconductor switching module includes an inexpensive, compact housing construction. Further, after a short circuit, there is no danger to station parts or persons. In at least one embodiment, the semiconductor switching module includes a housing, the housing having openings, which can be sealed by thin walls, to carry away pressure which occurs in the case of a short circuit, the thin walls being dimensioned so that they can be destroyed or removed by the pressure which occurs in the case of a short circuit, and the openings being dimensioned so that parts which carry current cannot be touched from outside. The semiconductor switching module according to at least one embodiment, despite being compact, inexpensive construction, still achieves a high short circuit value. Further, the disadvantages of the traditional open housing construction being avoided. In principle, this is achieved in that in the case of a short circuit, the pressure can be carried away via defined openings. In the case of normal operation, these openings are sealed by thin walls. By sealing in this way, for example, the sealing which is required in the case of bonded semiconductor switching modules can be kept in the housing, and an optically closed housing can be implemented.

Claims

1. A semiconductor switching module, comprising:

a housing, the housing including openings, sealable by walls, to carry away pressure which occurs in a case of a short circuit, the walls being dimensioned so as to be at least one of destroyable and removable by the pressure which occurs in the case of a short circuit, and the openings being dimensioned so that parts which carry current cannot be touched from outside.

2. The semiconductor switching module as claimed in claim 1, wherein at least one outer wall of the semiconductor switching module is in the form of part of the housing.

3. The semiconductor switching module as claimed in claim 1, wherein the semiconductor switching module is implemented as a power module with a direct copper bonding.

4. The semiconductor switching module as claimed in claim 1, wherein the housing is made of insulating plastic.

5. The semiconductor switching module as claimed in claim 1, wherein the thin walls are implemented as adhesive labels.

10. The semiconductor switching module as claimed in claim 2, wherein the semiconductor switching module is implemented as a power module with a direct copper bonding.

11. The semiconductor switching module as claimed in claim 2, wherein the housing is made of insulating plastic.

12. The semiconductor switching module as claimed in claim 2, wherein the thin walls are implemented as adhesive labels.

6. A housing for a semiconductor switching module, comprising:

openings, sealable by walls, to carry away pressure which occurs in the case of a short circuit, the walls being dimensioned to be at least one of destroyable and removable by the pressure which occurs in a case of a short circuit, and the openings being dimensioned so that parts which carry current cannot be touched from outside.

7. The housing as claimed in claim 6, wherein part of the housing is in the form of at least one outer wall of the semiconductor switching module.

8. The housing as claimed in claim 6, wherein the housing is made of insulating plastic.

9. The housing as claimed in claim 6, wherein the thin walls are implemented as adhesive labels.

13. The housing as claimed in claim 7, wherein the housing is made of insulating plastic.

14. The housing as claimed in claim 7, wherein the thin walls are implemented as adhesive labels.