WIRELESS IC DEVICE AND COMPONENT FOR WIRELESS IC DEVICE

• US 20080061983A1
• Filed: 10/31/2007
• Published: 03/13/2008
• Est. Priority Date: 01/19/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: DOKAI, Yuya, KATO, Noboru, ISHINO, Satoshi
• Granted Patent: US 7,764,928 B2
• Time in Patent Office: Days
• US Class Current: 340/572.5
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10727 : Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: Y02D 30/70 : in wireless communication networks

Abstract

A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Claims

1. A wireless IC device comprising:

a wireless IC;

a power supply circuit connected to the wireless IC, the power supply circuit including the first and second inductance elements which are magnetically coupled to each other, and the power supply circuit having a predetermined resonant frequency; and

a radiation pattern connected to the power supply circuit, arranged to perform at least one of radiation of a transmission signal supplied from the power supply circuit, and receiving of a reception signal and supplying the reception signal to the power supply circuit.

2. The wireless IC device according to claim 1, wherein the power supply circuit further includes a first capacitance element, and the first inductance element and the first capacitance element define a first resonant circuit.

3. The wireless IC device according to claim 2, wherein the first capacitor element is disposed downstream of the wireless IC and between the wireless IC and the first inductance element.

4. The wireless IC device according to claim 2, wherein the power supply circuit further includes a second capacitance element, and the second inductance element and the second capacitance element define a second resonant circuit.

5. The wireless IC device according to claim 4, wherein the first and second resonant circuits are coupled to each other.

6. The wireless IC device according to claim 1, wherein the power supply circuit is provided in a multilayer board in which one of a plurality of dielectric layers and a plurality of magnetic layers are layered, and the wireless IC is mounted on the multilayer board as an IC chip.

7. The wireless IC device according to claim 1, wherein the power supply circuit is provided on the surface of the single-layer board, and the wireless IC is mounted on the surface of the single-layer board as an IC chip.

8. The wireless IC device according to claim 1, wherein the power supply circuit and the wireless IC are disposed substantially in parallel on a board.

9. The wireless IC device according to claim 1, wherein the power supply circuit is formed on a rigid board, and the radiation pattern is made of a flexible metal film retained in a flexible resin film.

10. The wireless IC device according to claim 1, wherein the electric length of the radiation pattern is an integer multiple of a half wavelength of the resonant frequency.

11. The wireless IC device according to claim 1, wherein the wireless IC is connected to the power supply circuit via at least one of DC connection, magnetic coupling and capacitive coupling.

12. The wireless IC device according to claim 1, wherein the power supply circuit including an electrode pattern, and the power supply circuit and the radiation pattern are connected by DC connection between the electrode pattern of the power supply circuit and the radiation pattern.

13. The wireless IC device according to claim 1, wherein the power supply circuit including an electrode pattern, and the power supply circuit and the radiation pattern are connected by capacitive coupling between the electrode pattern of the power supply circuit and the radiation pattern.

14. The wireless IC device according to claim 1, wherein the power supply circuit including an electrode pattern, and the power supply circuit and the radiation pattern are connected by magnetic coupling between the electrode pattern of the power supply circuit and the radiation pattern.

15. A component for a wireless IC device comprising:

a wireless IC; and

a power supply circuit connected to the wireless IC, the power supply circuit including the first and second inductance elements which are magnetically coupled to each other, and the power supply circuit having a predetermined resonant frequency.

16. The wireless IC device according to claim 15, wherein the power supply circuit further includes a first capacitance element, and the first inductance element and the first capacitance element define a first resonant circuit.

17. The wireless IC device according to claim 15, wherein the first capacitor element is disposed downstream of the wireless IC and between the wireless IC and the first inductance element.

18. The wireless IC device according to claim 17, wherein the power supply circuit further includes a second capacitance element, and the second inductance element and the second capacitance element define a second resonant circuit.

19. The wireless IC device according to claim 18, wherein the first and second resonant circuits are coupled to each other.

20. The wireless IC device according to claim 15, wherein the power supply circuit is provided in a multilayer board in which one of a plurality of dielectric layers and a plurality of magnetic layers are layered, and the wireless IC is mounted on the multilayer board as an IC chip.

21. The wireless IC device according to claim 15, wherein the power supply circuit is provided on the surface of the single-layer board, and the wireless IC is mounted on the surface of the single-layer board as an IC chip.

22. The wireless IC device according to claim 15, wherein the power supply circuit and the wireless IC are disposed substantially in parallel on a board.

23. The wireless IC device according to claim 15, wherein the wireless IC is connected to the power supply circuit via at least one of DC connection, magnetic coupling and capacitive coupling.