ELECTROSTATIC CHUCK DEVICE

• US 20080062611A1
• Filed: 08/08/2007
• Published: 03/13/2008
• Est. Priority Date: 08/10/2006
• Status: Active Grant

• Current Assignee: Sumitomo Osaka Cement Company Limited, Tokyo Electron Limited
• Original Assignee: Sumitomo Osaka Cement Company Limited, Tokyo Electron Limited
• Inventors: HIMORI, Shinji, MAKI, Keigo, MATSUYAMA, Shoichiro, MIURA, Yukio, MATSUURA, Atsushi, KOSAKAI, Mamoru, INAZUMACHI, Hiroshi
• Granted Patent: US 8,284,538 B2
• Time in Patent Office: Days
• US Class Current: 361/234
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks

Abstract

An electrostatic chuck device includes an electrostatic chuck section, a metal base section, and a dielectric plate. The electrostatic chuck section has a substrate, a main surface of which serves as a mounting surface for a plate-like sample, an electrostatic-adsorption inner electrode built in the substrate, and a power supply terminal for applying a DC voltage to the electrostatic-adsorption inner electrode. Here, a dielectric plate is fixed to a concave portion formed in the metal base section. The dielectric plate and the electrostatic chuck section are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween. The dielectric plate and the concave portion are adhesively bonded to each other with a conductive adhesive bonding layer interposed therebetween, the volume resistivity of which is 1.0×10⁻²Ωcm or less.

Claims

1. An electrostatic chuck device comprising:

an electrostatic chuck section including a substrate, which has a main surface serving as a mounting surface on which a plate-like sample is mounted and an electrostatic-adsorption inner electrode built therein, and a power supply terminal for applying a DC voltage to the electrostatic-adsorption inner electrode; and

a metal base section that is fixed to the other main surface of the electrostatic chuck section so as to be incorporated into a body and that serves as a high frequency generating electrode,

wherein a concave portion is formed in the main surface of the metal base section facing the electrostatic chuck section and a dielectric plate is fixed to the concave portion,

wherein the dielectric plate and the electrostatic chuck section are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween, and

wherein the dielectric plate and the concave portion are adhesively bonded to each other with a conductive adhesive bonding layer interposed therebetween, the volume resistivity of which is 1.0×

10<sup>−

2</sup>Ω

cm or less.

2. An electrostatic chuck device according to claim 1, wherein the thickness of the dielectric plate decreases from the center to the peripheral edge.

3. An electrostatic chuck device according to claim 1 or 2, wherein the clearance between the dielectric plate and the concave portion is 0.1% or more of a diameter when the dielectric plate is circular and 0.1% or more of a diagonal length of a rectangular when the dielectric plate is rectangular.

4. An electrostatic chuck device according to claim 1 or 2, wherein the clearance between the dielectric plate and the concave portion is 2.0 mm or less.

5. An electrostatic chuck device according to claim 1 or 2, wherein the concave portion has a shape complementary to that of the main surface of the dielectric plate facing the concave portion.

6. An electrostatic chuck device according to claim 1 or 2, wherein the thermal conductivity between the electrostatic chuck section and the metal base section is uniform in the entire adsorption area of the electrostatic chuck section.

13. An electrostatic chuck device according to any one of claims 1, 2, 7, and 8, wherein the conductive adhesive bonding layer compromises a silicon-based adhesive bonding agent containing a conductive filler or a metal-based adhesive bonding agent.

14. An electrostatic chuck device according to any one of claims 1, 2, 7, and 8, wherein the electrostatic-adsorption inner electrode compromises a plurality of concentric electrode portions insulated from each other and the power supply terminals are connected to the respective electrode portions.

15. An electrostatic chuck device according to any one of claims 1, 2, 7, and 8, wherein an opening having an area in the range of 1/9 to 4/9 of the entire area of the electrostatic-adsorption inner electrode is formed at the central portion of the electrostatic-adsorption inner electrode and the opening is filled with an insulating material.

7. An electrostatic chuck device comprising:

an electrostatic chuck section including a substrate, which has a main surface serving as a mounting surface on which a plate-like sample is mounted and an electrostatic-adsorption inner electrode built therein, and a power supply terminal for applying a DC voltage to the electrostatic-adsorption inner electrode; and

a metal base section that is fixed to the other main surface of the electrostatic chuck section so as to be incorporated into a body and that serves as a high frequency generating electrode,

wherein a concave portion is formed in a main surface of the metal base section facing the electrostatic chuck section and the electrostatic chuck section is fixed to the concave portion, and

wherein the electrostatic chuck section and the concave portion are adhesively bonded to each other with a conductive adhesive bonding layer interposed therebetween, the volume resistivity of which is 1.0×

10<sup>−

2</sup>Ω

cm or less.

8. An electrostatic chuck device according to claim 7, wherein the thickness of the substrate decreases from the center to the peripheral edge.

9. An electrostatic chuck device according to claim 7 or 8, wherein the clearance between the substrate and the concave portion is 0.1% or more of a diameter when the substrate is circular and 0.1% or more of a diagonal length of a rectangular when the substrate is rectangular.

10. An electrostatic chuck device according to claim 7 or 8, wherein the clearance between the substrate and the concave portion is 2.0 mm or less.

11. An electrostatic chuck device according to claim 7 or 8, wherein the concave portion has a shape complementary to that of the other main surface of the substrate.

12. An electrostatic chuck device according to claim 7 or 8, wherein the thermal conductivity between the electrostatic chuck section and the metal base section is uniform in the entire adsorption area of the electrostatic chuck section.