ELECTROSTATIC CHUCK

• US 20080062612A1
• Filed: 09/05/2007
• Published: 03/13/2008
• Est. Priority Date: 09/07/2006
• Status: Abandoned Application

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: MORIOKA, Ikuhisa, AIHARA, Yasufumi
• Application Number:
  US11/850,284
• Publication Number:
  US 20080062612A1
• Time in Patent Office: Days
• US Class Current: 361/234
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks

Abstract

An electrostatic chuck including lower and upper regions of a ceramic base, an embedded electrode and a resin film formed on the surface of the base. Volume resistivity of the upper region is 1×10⁹ Ω·cm to 1×10¹² Ω·cm, surface roughness of the surface of the upper region is 0.4 μm or less in centerline average roughness Ra, and the resin film is made of denatured fluorine resin. A thickness of the resin film is 1 μm or more, variations of the thickness of the resin film are ±30% or less, static friction and dynamic friction coefficients of a surface of the resin film is 0.2 or less, hardness of the resin film is 3H to F in a pencil method, and a contact angle of the resin film with water is 85° or more.

Claims

1. An electrostatic chuck, comprising:

a base made of ceramics;

an electrode that is embedded in a vicinity of one surface of the base and generates electrostatic suction force; and

a resin film formed on the surface of the base,

wherein volume resistivity of the base in a region between the surface of the base and the electrode is 1×

10⁹ Ω

·

cm to 1×

10¹² Ω

·

cm, surface roughness of the surface of the base is 0.4 μ

m or less in centerline average roughness Ra,

the resin film is made of denatured fluorine resin,

a thickness of the resin film is 1 μ

m or more,

variations of the thickness of the resin film are ±

30% or less,

a static friction coefficient and dynamic friction coefficient of a surface of the resin film is 0.2 or less,

hardness of the resin film is 3H to F in a pencil method, and

a contact angle of the resin film with water is 85°

or more.

2. The electrostatic chuck according to claim 1, wherein the denatured fluorine resin of the resin film contains fluorine resin and polyamide-imide.

3. The electrostatic chuck according to claim 1, wherein volume resistivity of the resin film is 1×

10⁹ Ω

·

cm to 1×

10¹² Ω

·

cm.

4. The electrostatic chuck according to claim 1, wherein volume resistivity of the resin film is 1×

10¹⁵ Ω

·

cm or more.

5. The electrostatic chuck according to claim 4, wherein the thickness of the resin film is 1 μ

m to 50 μ

m.