HEAT DISSIPATION DEVICE FOR LIGHT EMITTING DIODE MODULE

• US 20080062694A1
• Filed: 09/07/2006
• Published: 03/13/2008
• Est. Priority Date: 09/07/2006
• Status: Abandoned Application

• Current Assignee: Foxconn Technology Co., Ltd.
• Original Assignee: Foxconn Technology Co., Ltd.
• Inventors: Lai, Cheng-Tien, Ding, Qiao-Li, Zhou, Zhi-Yong
• Application Number:
  US11/309,661
• Publication Number:
  US 20080062694A1
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21V 29/56 using liquid coolants F21V29/51 takes precedence
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F28D 1/0478 the conduits having a non-circular cross-section
• CPC Class Codes: F28D 1/05366 Assemblies of conduits connected to common headers, e.g. core type radiators
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28D 2021/0029 Heat sinks

Abstract

A heat dissipation device for a light emitting diode (LED) module includes a liquid cooling system. The liquid cooling system includes a heat-absorbing member, which includes an inlet, an outlet and at least one pipe extending between the inlet and the outlet. The inlet and the outlet are provided for permitting liquid to flow through the at least one pipe, which is in thermal contact with at least one LED of the LED module.

Claims

1. A heat dissipation device for a light emitting diode (LED) module, the heat dissipation device comprising:

a liquid cooling system comprising a heat-absorbing member, the heat-absorbing member comprising an inlet, an outlet and at least one pipe extending between the inlet and the outlet, wherein the inlet and the outlet are provided for permitting liquid to flow through the at least one pipe which is in thermal contact wit at least one LED of the LED module;

wherein the heat-absorbing member further comprises a plurality of fins. and the at least one pipe is inserted in the fins.

2. The heat dissipation device as claimed in claim 1, wherein the heat-absorbing member comprises a plurality of straight pipes each in thermal contact with at least one LED of the LED module, and a plurality of elbows serially interconnecting the straight pipes, wherein the straight pipes and the elbows corporately form a serpentine channel extending between the inlet and the outlet.

4. The heat dissipation device as claimed in claim 1, wherein each fin has at least one cutout, and the at least one cutout of the each fm aligns with each other to form a groove for accommodating the at least one pipe therein.

5. The heat dissipation device as claimed in claim 4, wherein the each fin comprises flanges beside the at least one cutout

6. The heat dissipation device as claimed in claim 4, wherein the fins are oriented to be transverse to the at least one pipe.

7. The heat dissipation device as claimed in claim 1, wherein the heat absorbing-member comprises a diverging member, a converging member and a plurality of parallel, straight pipes interconnecting the diverging member and the converging member.

8. The heat dissipation device as claimed in claim 7, wherein the inlet is formed at the diverging member, and the diverging member comprises a plurality of outlets branching from the diverging member and hermetically coupled to first ends of the straight pipes.

9. The heat dissipation device as claimed in claim 8, wherein the outlet is formed at the converging member, and the converging member comprises a plurality of inlets converged at the converging member and hermetically coupled to second ends of the straight pipes.

3. (canceled)

10. An LED package, comprising;

a printed circuit board having a plurality of LEDs arrayed thereon; and

a liquid cooling system, the liquid cooling system comprising;

a heat-absorbing member comprising a plurality of pipes attached to a bottom surface of the printed circuit board for in thermal contact with the LEDs; and

a pump for driving liquid flowing through the pipes of the heat-absorbing member;

wherein the heat-absorbing member further comprises plurality of fins mounted on the bottom surface of the printed circuit board, and the pipes are sandwiched between the fins and the printed circuit board.

11. The LED package as claimed in claim 10, wherein the liquid cooling system further comprises a heat-dissipating member and tubes connecting the pipes with the heat-dissipating member to form a loop for circulation of the liquid.

12. The LED package as claimed in claim 10, wherein the pipes of the heat-absorbing member comprise a plurality of straight pipes and a plurality of bent pipes interconnecting the straight pipes, and wherein the straight pipes and the bent pipes corporately form a serial and serpentine channel for the liquid flowing therein.

13. The LED package as claimed in claim 10, wherein the beat absorbing-member comprises a diverging member and a converging member, and the pipes are parallel to each other and interconnect the diverging member and the converging member.

15. The LED package as claimed in claim 10, wherein the printed circuit board defines a plurality of through holes therein for the LEDs extending therethrough and electrically bonded to the printed circuit board.

16. The LED package as claimed in claim 15, wherein bottom surfaces of the LEDs commonly define a surface for directly contacting with the pipes of the heat-absorbing member, and wherein the surface of the LEDs is coplanar with the bottom surface of the printed circuit board.

17. The LED package as claimed in claim 15, wherein bottom surfaces of the LEDs commonly define a surface for directly contacting with the pipes of the heat-absorbing member, and wherein the surface of the LEDs is located at a level below the bottom surface of the printed circuit board.

14. (canceled)

18. A light-emitting-diode (LED) module comprising:

a plurality of LEDs arranged on a printed circuit;

a plurality of pipes with which bottoms of the plurality of LEDs are thermally connected, wherein fluid flows through the pipes to take heat generated by the LEDs away from the LEDs;

wherein the light-emitting-diode module further comprises a plurality of fins, and adjacent pipes are separated from each other by the fins.

19. The light-emitting-diode module as claimed in claim 18, wherein the pipes are connected together in a serial manner.

20. The light-emitting-diode module as claimed in claim 18, wherein the pipes are arranged in a parallel manner.