ELECTRICAL DEVICE HAVING BOARDLESS ELECTRICAL COMPONENT MOUNTING ARRANGEMENT

• US 20080062711A1
• Filed: 08/21/2007
• Published: 03/13/2008
• Est. Priority Date: 08/21/2006
• Status: Active Grant

• Current Assignee: Innotec, Corp.
• Original Assignee: Innotec, Corp.
• Inventors: Lanser, Michael, Weeda, Matthew, Vander Pol, Mark, Israels, Kyle, Veenstra, Thomas, Mulder, Jason, Vander Kuyl, Paul
• Granted Patent: US 7,909,482 B2
• Time in Patent Office: Days
• US Class Current: 362/546
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21W 2106/00 Interior vehicle lighting devices
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H05K 1/187 the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.

Claims

1. :

A light assembly, comprising;

a sheet metal circuit including at least two electrically conductive circuit elements, each circuit element defining opposite side surfaces;

at least one LED electrically connected to the circuit elements;

at least one electrical component electrically connected to the circuit elements, wherein the one electrical component is selected from the group consisting of a resistor, a diode, a zener diode, a transistor, an integrated circuit, a capacitor, an inductor, a transient voltage suppressor, and a metal oxide varister; and

wherein the electrical component is capable of affecting at least one of the voltage and electrical current supplied to the LED;

a one-piece body comprising thermoplastic polymer material encasing the LED, the one electrical component, and at least a portion of the opposite side surfaces of the circuit elements.

2. :

The light assembly of claim 1, wherein;

the electrically conductive circuit elements have a substantially uniform thickness of at least about 0.008 inches thick.

3. :

The light assembly of claim 1, wherein;

the thermoplastic polymer includes a light-transmitting portion encapsulating the LED.

4. :

The light assembly of claim 1, wherein;

the sheet metal circuit includes at least two cantilevered prongs having exposed metal, and the polymer material includes a cavity having an open end to thereby form a receptacle around the prongs.

5. :

The light assembly of claim 1, wherein;

the polymer material forms a mounting flange having at least one opening therethrough configured to receive a fastener to mount the light assembly.

6. :

The light assembly of claim 1, wherein;

the light assembly comprises an exterior light for a motor vehicle, and wherein the electrical component forms a driver circuit capable of supplying a desired electrical current to the LED when the light assembly is connected to a vehicle 12 volt D.C. power source.

7. :

The light assembly of claim 6, wherein;

the polymer material comprises a translucent material.

8. :

The light assembly of claim 7, wherein;

all portions of the polymer material have substantially the same composition and color.

9. :

The light assembly of claim 7, wherein;

the polymer material is red.

10. :

The light assembly of claim 7, wherein;

the polymer material is amber.

11. :

The light assembly of claim 7, wherein;

the polymer material is substantially clear.

12. :

The light assembly of claim 1, wherein;

the LED comprises a white LED.

13. :

The light assembly of claim 1, wherein;

the LED comprises a colored LED.

14. :

The light assembly of claim 1, wherein;

the polymer material includes raised outer surface portions over the LEDs.

15. :

The light assembly of claim 1, wherein;

the electrical component forms an LED driver circuit capable of providing the LED with a desired electrical current when the light assembly is connected to a 120 volt A.C. power source.

16. :

The light assembly of claim 1, wherein;

the circuit elements include a planar primary portion, and wherein the LED and the electrical component are mounted to the primary portion;

the circuit elements including an intermediate portion extending transversely from the primary portion, and an end portion extending transversely from the intermediate portion, the circuit elements further including cantilevered prongs extending from the end portion, and wherein the primary, intermediate, and end portions are encapsulated by the polymer material, and the prongs are exposed.

17. :

The light assembly of claim 16, wherein;

the polymer material forms a receptacle around the prongs.

18. :

A method of forming a light assembly, comprising;

cutting a sheet of conductive material to form a sheet metal circuit having at least two electrically conductive circuit elements, each having first and second opposite sides;

securing at least one electrical component to the first sides of the circuit elements;

positioning the circuit and electrical component in a first mold cavity having a first shape;

molding thermoplastic polymer material around the electrical component while it is in the first mold cavity to encapsulate the electrical component in a protective capsule of polymer material, the protective capsule having a first portion in contact with the first sides of the conductive circuit elements around the electrical component, the protective capsule having peripheral edge portions extending around at least a portion of the electrical component;

positioning the circuit element and electrical component in a second mold cavity having a second shape that is substantially different than the first shape;

molding thermoplastic polymer material over at least a portion of the protective capsule.

19. :

The method of claim 18, wherein;

the first sides of the conductive circuit elements define generally flat first surface portions;

the peripheral edge portions extend to the flat first surface portion and define a peripheral edge surface that is transverse to the flat surface portion.

20. :

The method of claim 19, wherein;

an exposed portion of the first surface portion is not covered by the protective capsule of polymer prior to positioning the circuit and electrical component in the second mold cavity; and

including;

molding thermoplastic polymer material over the exposed portion.

21. :

The method of claim 20, wherein;

the first mold cavity is shaped to mold additional thermoplastic polymer material over at least a substantial portion of the first sides of the conductive circuit elements, wherein the additional thermoplastic material includes an edge portion that is spaced apart from the protective capsule to define a groove extending around the electrical component.

22. :

The method of claim 21, wherein;

the groove formed by the first mold cavity is generally C-shaped in plan view, and wherein a bridge of polymer material extends from the additional polymer material to the protective capsule.

23. :

The method of claim 21, wherein;

the groove defines a base surface, and at least a portion of the base surface comprises exposed conductive material.

24. :

The method of claim 18, wherein;

the step of securing at least one electrical circuit component includes soldering the circuit component to the circuit element.

25. :

The method of claim 18, wherein;

the step of securing at least one electrical circuit component includes deforming the conductive circuit element to crimp the circuit component to the conductive circuit element.

26. :

The method of claim 18, wherein;

the electrical component comprises an LED.

27. :

The method of claim 26, including;

molding a light-control feature over the LED utilizing the thermoplastic material.

28. :

The method of claim 26, wherein;

at least one additional electrical component in addition to the LED is secured to the circuit element; and

a protective capsule of thermoplastic polymer material is molded over the additional electrical component.

29. :

The method of claim 26, wherein;

the capsule is generally dome-shaped.

30. :

The method of claim 18, wherein;

the electrical component comprises an integrated circuit having a generally quadrilateral perimeter;

the peripheral edge of the capsule of polymer material has a generally quadrilateral shape.

31. :

The method of claim 18, including;

forming a first generally flat portion of the conductive circuit element;

forming a second portion of the conductive circuit element that extends transversely from the first portion; and

molding polymer material over at least a substantial portion of the first and second portions of the conductive circuit element.

32. :

The method of claim 31, wherein;

the electrical component comprises an LED that is secured to the first portion of the conductive circuit element.

33. :

The method of claim 31, including;

forming a third portion of the conductive circuit element that extends transversely from the second portion;

forming at least two prongs that extend from the third portion; and

molding a receptacle in the form of a tubular wall forming a cavity having an open outer end, wherein the prongs are disposed in the cavity.

34. :

The method of claim 18, wherein;

the conductive circuit element defines an outer edge; and

including;

molding thermoplastic material to form a mounting flange that extends outwardly from the outer edge.

35. :

A mold tool for overmolding electrical components mounted to a conductive circuit element, the mold tool comprising;

first and second mold parts that are configured to operably engage one another;

the first mold part having a first contact surface configured to contact a first side of a generally flat conductive circuit element positioned in the mold tool;

the second mold part having a first cavity portion and a sealing surface extending around the cavity, wherein the sealing surface is configured to contact a second side of a generally flat conductive circuit element positioned in the mold tool, the second mold part having a second cavity portion connected to the first cavity portion by a passageway that permits flow of molten polymer material from the second cavity portion to the first cavity portion.

36. :

The mold tool of claim 35, wherein;

the second mold part includes a raised ridge having a flat end surface that forms the sealing surface.

37. :

The mold tool of claim 35, wherein;

the first cavity is generally bowl-shaped.

38. :

The mold tool of claim 35, wherein;

the second mold part includes a plurality of first cavity portions having sealing surfaces extending around each first cavity portion and passageways interconnecting each first cavity portion to the second cavity portion.