Microelectronic Device with Anti-Stiction Coating
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Accused Products
Abstract
One embodiment of a microelectronic device includes a movable plate including a lower surface, a bump positioned on the lower surface, and an anti-stiction coating positioned only on the bump.
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Citations
66 Claims
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1-11. -11. (canceled)
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12. A process of manufacturing a microelectronic device, comprising:
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placing a wafer in a deposition chamber, said wafer including a plurality of anti-stiction bump regions; and
depositing an anti-stiction coating only on said bump regions. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A process of depositing an anti-stiction coating, comprising:
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enclosing a microelectromechanical device (MEMS device) in a deposition chamber, said MEMS device including a bump area; and
depositing an anti-stiction coating only on said bump area. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40-59. -59. (canceled)
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60. A process of depositing an anti-stiction coating, comprising:
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positioning a microelectronic device for deposition, said microelectronic device including at least one bump region; and
selectively reacting fluorodecyltrichlorosilane only on said bump region of said microelectronic device. - View Dependent Claims (61, 62, 63, 64, 65)
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66. (canceled)
Specification