HIGH RESOLUTION SPATIAL LIGHT MODULATION

• US 20080063796A1
• Filed: 11/07/2007
• Published: 03/13/2008
• Est. Priority Date: 10/23/2003
• Status: Abandoned Application

• Current Assignee: Spatial Photonics Incorporated (Himax Technologies Incorporated)
• Original Assignee: Spatial Photonics Incorporated (Himax Technologies Incorporated)
• Inventors: Pan, Shaoher
• Application Number:
  US11/936,711
• Publication Number:
  US 20080063796A1
• Time in Patent Office: Days
• US Class Current: 427/162
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

Methods and apparatus for providing a high-resolution spatial light modulator. A spatial light modulator includes a cell that includes: a substrate portion; a first support post and a second support post, each having a top surface; and a micro mirror. The micro mirror includes a bottom layer that includes a hinge member having a longitudinal axis, a width across the longitudinal axis, a first end on the longitudinal axis, and a second end on the longitudinal axis. The first end and second end is secured to the first support post and the second support post, respectively. The hinge member has a same thickness of the bottom layer, wherein the width of the hinge member is greater than a thickness of the bottom layer.

Claims

1. A method for making a spatial light modulator, the method comprising:

forming a control substrate;

forming a first support post and a second support post on the substrate;

forming a layer of amorphous silicon by vapor deposition of amorphous silicon on the substrate, wherein a thickness of the layer is controlled by controlling the vapor deposition; and

patterning the layer to form a bottom layer of a micro mirror, the bottom layer including a hinge member about which the micro mirror is configured to tilt, the hinge member having a first end secured to the first support post and a second end secured to the second support post.

2. The method of claim 1, further comprising planarizing the layer of amorphous silicon.

3. The method of claim 1, further comprising:

forming a middle layer of the micro mirror on the bottom layer, the middle layer including a recess configured to accommodate the hinge member; and

forming a reflective top layer of the micro mirror on the middle layer.

4. The method of claim 1, further comprising:

forming a plurality of electrodes on the control substrate; and

forming a plurality of vertical landing tips on the control substrate.

5. The method of claim 4, wherein forming a plurality of electrodes includes forming step electrodes.

6. The method of claim 4, wherein forming a plurality of vertical landing tips includes forming vertical landing tips having a top horizontal portion that is configured to contact the bottom layer when the micro mirror is tilted.

7. The method of claim 1, further comprising forming a hinge support frame to buttress the support posts, the hinge support frame being completely hidden underneath the micro mirror.