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Thermal processing system for curing dielectric films

  • US 20080063809A1
  • Filed: 09/08/2006
  • Published: 03/13/2008
  • Est. Priority Date: 09/08/2006
  • Status: Active Grant
First Claim
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1. A processing system for treating a dielectric film on a substrate, comprising:

  • a process chamber configured to facilitate said treatment process;

    a substrate holder coupled to said process chamber, and configured to support said substrate in said process chamber;

    a temperature control system coupled to said substrate holder and configured to elevate a temperature of said substrate;

    a multi-spectrum radiation source coupled to said process chamber, and configured to irradiate said substrate with infrared (IR) radiation and ultraviolet (UV) radiation, said multi-spectrum radiation source including;

    an IR radiation source comprising a first array of IR light-emitting devices (LEDs), anda UV radiation source comprising a second array of UV LEDs; and

    a vacuum pumping system coupled to said process chamber, and configured to evacuate said process chamber.

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