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Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package

  • US 20080063871A1
  • Filed: 09/10/2007
  • Published: 03/13/2008
  • Est. Priority Date: 09/11/2006
  • Status: Abandoned Application
First Claim
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1. An adhesive film composition, comprising:

  • an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group;

    a film-forming resin having a glass transition temperature of about −

    10°

    C. to about 200°

    C.;

    an epoxy resin;

    a phenol-type curing agent;

    a curing catalyst;

    a pre-curable additive;

    a silane coupling agent; and

    a filler.

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