Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package
First Claim
Patent Images
1. An adhesive film composition, comprising:
- an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group;
a film-forming resin having a glass transition temperature of about −
10°
C. to about 200°
C.;
an epoxy resin;
a phenol-type curing agent;
a curing catalyst;
a pre-curable additive;
a silane coupling agent; and
a filler.
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Abstract
An adhesive film composition, including an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin having a glass transition temperature of about −10° C. to about 200° C., an epoxy resin, a phenol-type curing agent, a curing catalyst, a pre-curable additive, a silane coupling agent, and a filler.
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Citations
18 Claims
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1. An adhesive film composition, comprising:
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an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group;
a film-forming resin having a glass transition temperature of about −
10°
C. to about 200°
C.;
an epoxy resin;
a phenol-type curing agent;
a curing catalyst;
a pre-curable additive;
a silane coupling agent; and
a filler. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A dicing die bonding film, comprising:
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a base film;
a first adhesive layer (PSA); and
an adhesive film, the first adhesive layer (PSA) being disposed between the base film and the adhesive film, wherein the adhesive film includes a composition having;
an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group;
a film-forming resin having a glass transition temperature of about −
10°
C. to about 200°
C.;
an epoxy resin;
a phenol-type curing agent;
a curing catalyst;
a pre-curable additive;
a silane coupling agent; and
a filler.
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18. A semiconductor package, comprising:
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a semiconductor device;
an adhesive film; and
a substrate, the adhesive film being disposed between the semiconductor device and the substrate, wherein the adhesive film includes a composition having;
an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group;
a film-forming resin having a glass transition temperature of about −
10°
C. to about 200°
C.;
an epoxy resin;
a phenol-type curing agent;
a curing catalyst;
a pre-curable additive;
a silane coupling agent; and
a filler.
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Specification