Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package

• US 20080063871A1
• Filed: 09/10/2007
• Published: 03/13/2008
• Est. Priority Date: 09/11/2006
• Status: Abandoned Application

• Current Assignee: Chell Industries, Inc.
• Original Assignee: Chell Industries, Inc.
• Inventors: Kim, Wan, Chung, Chang, Jung, Ki, Hong, Yong, Jeong, Chul
• Application Number:
  US11/898,143
• Publication Number:
  US 20080063871A1
• Time in Patent Office: Days
• US Class Current: 428/414
• CPC Class Codes: C08K 2201/005 Additives being defined by their particle size in general
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08K 5/5435 containing oxygen in a ring
• CPC Class Codes: C08K 5/544 containing nitrogen
• CPC Class Codes: C08K 5/548 containing sulfur C08K5/5477 takes precedence
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2224/274 by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29191 The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0104 : Zirconium [Zr]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/066 : Phenolic resin
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0715 : Polysiloxane
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: Y10T 428/31511 : Of epoxy ether
• CPC Class Codes: Y10T 428/31515 : As intermediate layer

Abstract

An adhesive film composition, including an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin having a glass transition temperature of about −10° C. to about 200° C., an epoxy resin, a phenol-type curing agent, a curing catalyst, a pre-curable additive, a silane coupling agent, and a filler.

Claims

1. An adhesive film composition, comprising:

an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group;

a film-forming resin having a glass transition temperature of about −

10°

C. to about 200°

C.;

an epoxy resin;

a phenol-type curing agent;

a curing catalyst;

a pre-curable additive;

a silane coupling agent; and

a filler.

2. The adhesive film composition as claimed in claim 1, further comprising an organic solvent.

3. The adhesive film composition as claimed in claim 1, wherein the composition comprises, based on the weight of the elastomer resin:

about 10 to about 60 parts by weight of the film-forming resin;

about 10 to about 60 parts by weight of the epoxy resin;

about 5 to about 30 parts by weight of the phenol-type curing agent;

about 0.01 to about 5 parts by weight of the curing catalyst;

about 0.01 to about 30 parts by weight of the pre-curable additive;

about 0.01 to about 10 parts by weight of the silane coupling agent; and

about 0.1 to about 60 parts by weight of the filler.

4. The adhesive film composition as claimed in claim 1, wherein the elastomer resin has a weight average molecular weight of about 500 to about 5,000,000.

5. The adhesive film composition as claimed in claim 1, wherein the film-forming resin includes one or more of a phenol resin or a phenoxy resin, has one or more of a hydroxy group, an epoxy group, a phenoxy group or an alkyl group, and has a weight average molecular weight of about 200 to about 300,000.

6. The adhesive film composition as claimed in claim 1, wherein the epoxy resin includes one or more of a bisphenol epoxy resin, a phenol novolac epoxy resin, an ortho-cresol novolac epoxy resin, a multi-functional epoxy resin, an amine epoxy resin, a heterocyclic epoxy resin, a substituted epoxy resin, or a naphthol epoxy resin.

7. The adhesive film composition as claimed in claim 6, wherein the phenol-type curing agent includes one or more of a phenol novolac resin, a xylok resin, a bisphenol A novolac resin, or a cresol novolac resin.

8. The adhesive film composition as claimed in claim 7, wherein the curing catalyst includes one or more of a melamine-type catalyst, an imidazole-type catalyst, or a triphenylphosphine-type catalyst.

9. The adhesive film composition as claimed in claim 1, wherein the pre-curable additive includes an isocyanate.

10. The adhesive film composition as claimed in claim 9, wherein the pre-curable additive includes one or more of the following isocyanates:

4,4′

-diphenylmethane diisocyanate, trilene diisocyanate, xylene diisocyanate, 4,4′

-diphenylether diisocyanate, 4,4′

-[2,2-bis(4-phenoxyphenylpropane)]diisocyanate, hexamethylene diisocyanate, 4,4′

-dicyclohexylmethane diisocyanate, 2,4′

-dicyclohexylmethane diisocyanate, 2,2,4-trimethyl-hexamethylene diisocyanate, isophorone diisocyanate, lysine diisocyanate, cyclohexylmethane diisocyanate, 1,6-hexamethylene diisocyanate, or a reaction product of diisocyanate or triisocyanate with polyol.

11. The adhesive film composition for semiconductor assembly as claimed in claim 1, wherein the pre-curable additive includes an amine.

12. The adhesive film composition as claimed in claim 11, wherein the pre-curable additive includes one or more of the following amines:

diethylene triamine, triethylene tetramine, diethylaminopropylamine, menthane diamine, N-aminoethyl piperazine, m-xylene diamine, or isophorone diamine.

13. The adhesive film composition as claimed in claim 1, wherein the silane coupling agent includes one or more of an amine-containing silane, an epoxy-containing silane, or a mercapto-containing silane.

14. The adhesive film composition as claimed in claim 13, wherein the filler is a spherical or amorphous inorganic filler containing metal or nonmetal components, and has a size of about 5 nm to about 20 μ

m.

15. The adhesive film composition as claimed in claim 1, further comprising an ion scavenger, wherein the ion scavenger includes one or more of a triazine-thiol compound, a zirconium compound, an antimony-bismuth compound, or a magnesium-aluminum compound.

16. The adhesive film composition as claimed in claim 15, wherein the composition comprises, based on the weight of the elastomer resin, about 0.01 to about 5 parts by weight of the ion scavenger.

17. A dicing die bonding film, comprising:

a base film;

a first adhesive layer (PSA); and

an adhesive film, the first adhesive layer (PSA) being disposed between the base film and the adhesive film, wherein the adhesive film includes a composition having;

an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group;

a film-forming resin having a glass transition temperature of about −

10°

C. to about 200°

C.;

an epoxy resin;

a phenol-type curing agent;

a curing catalyst;

a pre-curable additive;

a silane coupling agent; and

a filler.

18. A semiconductor package, comprising:

a semiconductor device;

an adhesive film; and

a substrate, the adhesive film being disposed between the semiconductor device and the substrate, wherein the adhesive film includes a composition having;

an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group;

a film-forming resin having a glass transition temperature of about −

10°

C. to about 200°

C.;

an epoxy resin;

a phenol-type curing agent;

a curing catalyst;

a pre-curable additive;

a silane coupling agent; and

a filler.