Pellicle for photolithography

• US 20080063952A1
• Filed: 09/10/2007
• Published: 03/13/2008
• Est. Priority Date: 09/11/2006
• Status: Active Grant

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: Shirasaki, Toru
• Granted Patent: US 7,901,841 B2
• Time in Patent Office: Days
• US Class Current: 430/5
• CPC Class Codes: G03F 1/64 characterised by the frames, e.g. structure or material, including bonding means therefor

Abstract

In a photolithographic pellicle for dustproof protection of a photomask for photolithographic patterning by mounting thereon with the aid of a pressure-sensitive adhesive layer on one end surface of the pellicle frame, the adverse influence on the flatness of the photomask caused by mounting the pellicle can be minimized when the thickness of the pressure-sensitive adhesive layer is 0.4 mm or larger or when the elastic modulus of the layer does not exceed 0.5 MPa.

Claims

1. A pellicle for photolithography comprising a frame, a film bonded on one end face of said frame, and a layer of pressure-sensitive adhesive coated on an opposite end face of said frame, wherein the pressure-sensitive adhesive layer has a thickness of at least 0.4 mm.

2. A pellicle for photolithography comprising a frame, a film bonded on one end face of said frame, and a layer of pressure-sensitive adhesive coated on an opposite end face of said frame, wherein the pressure-sensitive adhesive layer has an elastic modulus not exceeding 0.5 Mpa at 23°

C.