Dynamic quantity sensor
First Claim
1. A dynamic quantity sensor comprising:
- a base;
a sensor chip made of a rectangular board having a corner portion, the sensor chip including a detector having a movable part, which is displaceable when a dynamic quantity is applied thereto, wherein the detector detects the dynamic quantity based on a capacitance variation in accordance with a displacement of the movable part, and a plurality of pads; and
a bump for electrically and mechanically connecting the plurality of pads of the sensor chip and the base, wherein the corner portion of the sensor chip is released from the base such that the plurality of pads of the sensor chip is arranged at a location a predetermined distance from the corner portion of the sensor chip.
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Accused Products
Abstract
A dynamic quantity sensor includes a base, a sensor chip made of a rectangular board having a corner portion, and a bump. The sensor chip includes a detector, and a plurality of pads. The detector has a movable part, which is displaceable when a dynamic quantity is applied thereto, and detects the dynamic quantity based on a capacitance variation in accordance with a displacement of the movable part. The bump connects the plurality of pads of the sensor chip and the base. The corner portion of the sensor chip is released from the base such that the plurality of pads of the sensor chip is arranged at a location a predetermined distance from the corner portion of the sensor chip.
45 Citations
13 Claims
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1. A dynamic quantity sensor comprising:
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a base;
a sensor chip made of a rectangular board having a corner portion, the sensor chip including a detector having a movable part, which is displaceable when a dynamic quantity is applied thereto, wherein the detector detects the dynamic quantity based on a capacitance variation in accordance with a displacement of the movable part, and a plurality of pads; and
a bump for electrically and mechanically connecting the plurality of pads of the sensor chip and the base, wherein the corner portion of the sensor chip is released from the base such that the plurality of pads of the sensor chip is arranged at a location a predetermined distance from the corner portion of the sensor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A dynamic quantity sensor comprising:
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a base;
a sensor chip made of a rectangular board having a corner portion, the sensor chip including a first detector and a second detector, which are symmetrical to each other relative to a first line for dividing the sensor chip into two equal parts, and a plurality of pads; and
a bump for electrically and mechanically connecting the base and the plurality of pads of the sensor chip, wherein each of the first and second detectors has a movable part, which is driven to perform a drive vibration in a first direction approximately perpendicular to the first line, and which is detected to perform a detection vibration due to a Coliolis force generated in a second direction approximately parallel to the first line when an angular velocity is applied to the movable part, such that the angular velocity is calculated based on a capacitance variation between the movable part and a fixed part opposing to the movable part, the plurality of pads is arranged in the first line or a second line for dividing the sensor chip into two equal parts in the first direction, the plurality of pads arranged in the second line is arranged on the fixed part for detecting the drive vibration or the detection vibration, and the corner portion of the sensor chip is released from the base.
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13. A dynamic quantity sensor comprising:
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a base;
a sensor chip made of a rectangular board having a corner portion, the sensor chip including a detector, which is driven to perform a drive vibration in a first direction, and which is detected to perform a detection vibration due to a Coliolis force generated in a second direction approximately perpendicular to the first direction when an angular velocity is applied to the detector, such that the angular velocity is calculated based on a capacitance variation of the detector, a plurality of pads; and
a bump for electrically and mechanically connecting the base and the plurality of pads of the sensor chip, wherein the plurality of pads of the sensor chip is arranged in the first direction or the second direction to be at a location a predetermined distance from the corner portion of the sensor chip.
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Specification