Surface mounting structure for a surface mounting electronic component

• US 20080066955A1
• Filed: 09/13/2007
• Published: 03/20/2008
• Est. Priority Date: 09/15/2006
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Original Assignee: Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Inventors: Takagi, Haruo, Nodo, Takamasa
• Granted Patent: US 8,263,875 B2
• Time in Patent Office: Days
• US Class Current: 174/261
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/09254 Branched layout
• CPC Class Codes: H05K 2201/09281 Layout details of a single conductor
• CPC Class Codes: H05K 2201/09381 Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A surface mounting structure for a surface mounting electronic component comprises an electronic component a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.

Claims

1. A surface mounting structure for a surface mounting electronic component, comprising:

an electronic component having electrodes at opposite ends thereof;

a land connected to each electrode through a solder;

a wiring connected to the land, the wiring having a width which is smaller than a width of the electronic component in a width direction thereof; and

an electrical connection pattern to which the wiring is connected, the electrical connection pattern having on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.

2. The surface mounting structure according to claim 1, wherein the wiring is formed so as to incline with respect to a longitudinal direction of the electronic component.

3. The surface mounting structure according to claim 1, wherein the wiring is formed so as to extend perpendicularly to a longitudinal direction of the electronic component.

4. The surface mounting structure according to claim 1, wherein the wiring is formed so as to bend.

5. The surface mounting structure according to claim 4, wherein the wiring is formed substantially in an L shape.

6. The surface mounting structure according to claim 1, wherein the wiring is formed so as to branch.

7. The surface mounting structure according to claim 6, wherein the wiring is formed substantially in a T shape.

8. The surface mounting structure according to claim 1, wherein a plurality of the electronic components are connected in parallel to each other through the wiring or the electrical connection pattern.

9. The surface mounting structure according to claim 1, wherein the land includes a restriction portion for the solder to form thereon into a fillet which faces an end face of the electronic component in a direction perpendicular to the longitudinal direction of the electronic component, and which restricts movement of the electronic component in melting the solder, and a projection for the solder to form thereon into a fillet which faces a side face of the electronic component in the longitudinal direction of the electronic component.

10. The surface mounting structure according to claim 9, wherein the restriction portion has in the width direction of the electronic component a width which is substantially the same as the width of the electronic component.

11. The surface mounting structure according to claim 9, wherein the restriction portion has in the longitudinal direction of the electronic component a length which is larger than a length of the projection in the width direction of the electric component.

12. The surface mounting structure according to claim 9, wherein the projection has in the longitudinal direction of the electronic component a width which is larger than a length of a side face of the electrode in the longitudinal direction of the electronic component.

13. The surface mounting structure according to claim 9, wherein the projection is formed in a semicircular shape.