PHOTO-RADIATION SOURCE

• US 20080067527A1
• Filed: 09/20/2007
• Published: 03/20/2008
• Est. Priority Date: 03/29/2004
• Status: Abandoned Application

• Current Assignee: Articulated Technologies, LLC
• Original Assignee: Articulated Technologies, LLC
• Inventors: Daniels, John, Nelson, Gregory
• Application Number:
  US11/858,346
• Publication Number:
  US 20080067527A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G03G 15/6582 Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 428/917 Electroluminescent

Abstract

A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.

Claims

1. A photo-radiation source for the selective polymerization of photo-radiation-curable organic material, comprising:

a plurality of light emitting diode chips for generating a photo-radiation spectrum effective for the selective polymerization of photo-radiation-curable organic material, each chip having an anode and a cathode;

a first electrode in contact with each anode of the respective light emitting diode chips; and

a second electrode in contact with each cathode of the respective light emitting diode chips, wherein at least one of the first electrode and the second electrode comprises a transparent conductor.

2. A photo-radiation source according to claim 1;

wherein the plurality of chips are permanently fixed in a formation by being squeezed between the first electrode and the second electrode without the use of solder or wiring bonding.

3. A photo-radiation source according to claim 1;

wherein the plurality of chips are permanently fixed in a formation by being adhered to at least one of the first electrode and the second electrode using an intrinsically conjugated polymer.

4. A photo-radiation source according to claim 3;

wherein the intrinsically conjugated polymer comprises a benzene derivative.

5. A photo-radiation source according to claim 3;

wherein the intrinsically conjugated polymer comprises a polythiophene.

6. A photo-radiation source according to claim 1;

wherein the photo-radiation spectrum comprises a range between and including UV and blue light.

7. A photo-radiation source according to claim 1;

wherein the photo-radiation spectrum comprises a range between and including 365 and 405 nm.

8. A photo-radiation source according to claim 1;

wherein the photo-radiation spectrum comprises a range including 420 nm.

9. A photo-radiation source according to claim 1;

wherein the first electrode and the second electrode are planar and flexible and are disposed on flexible substrates.

10. A photo-radiation source according to claim 9;

wherein the flexible substrates a shaped into an optical geometry effective for controlling light emitted from the plurality of light emitting diode chips.

11. A photo-radiation source according to claim 10;

wherein at least one of the flexible substrates includes a first optical system associated with it for controlling light emitted from the plurality of light emitting diode chips.

12. A photo-radiation source according to claim 10;

further comprising a second optical system disposed adjacent to one of the substrates for controlling light emitted from the plurality of light emitting diode chips.

13. A photo-radiation source according to claim 1;

further comprising an optical system for controlling light emitted from the plurality of light emitting diode chips.