Structure and manufacturing method of a chip scale package
First Claim
Patent Images
1. A chip package comprising:
- a ball grid array (BGA) substrate having a first surface and a second surface opposite to said first surface;
a semiconductor device comprising a passivation layer and a first pad exposed by an opening in said passivation layer;
a copper pillar between said first pad and said first surface, wherein said copper pillar has a height between 10 and 100 micrometers;
a barrier metal layer between said first pad and said copper pillar, wherein said barrier metal layer is on said first pad, over said passivation layer and in said opening;
a nickel layer between said copper pillar and said first surface, wherein said copper pillar has a transverse dimension smaller than that of said nickel layer, wherein said copper pillar has a first sidewall recessed from a second sidewall of said nickel layer, wherein a distance between said first sidewall and said second sidewall is greater than 0.2 micrometers, and wherein said nickel layer comprises a first portion over said copper pillar and a second portion overhanging said copper pillar;
a solder metal between said nickel layer and said first surface, wherein said solder metal is joined with said ball grid array (BGA) substrate;
an underfill between said semiconductor device and said first surface, wherein said underfill contacts with said semiconductor device and said first surface and encloses said copper pillar and said solder metal; and
a contact ball on said second surface.
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Abstract
A new method and package is provided for the mounting of semiconductor devices that have been provided with small-pitch Input/Output interconnect bumps. Fine pitch solder bumps, consisting of pillar metal and a solder bump, are applied directly to the I/O pads of the semiconductor device, the device is then flip-chip bonded to a substrate. Dummy bumps may be provided for cases where the I/O pads of the device are arranged such that additional mechanical support for the device is required.
107 Citations
20 Claims
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1. A chip package comprising:
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a ball grid array (BGA) substrate having a first surface and a second surface opposite to said first surface;
a semiconductor device comprising a passivation layer and a first pad exposed by an opening in said passivation layer;
a copper pillar between said first pad and said first surface, wherein said copper pillar has a height between 10 and 100 micrometers;
a barrier metal layer between said first pad and said copper pillar, wherein said barrier metal layer is on said first pad, over said passivation layer and in said opening;
a nickel layer between said copper pillar and said first surface, wherein said copper pillar has a transverse dimension smaller than that of said nickel layer, wherein said copper pillar has a first sidewall recessed from a second sidewall of said nickel layer, wherein a distance between said first sidewall and said second sidewall is greater than 0.2 micrometers, and wherein said nickel layer comprises a first portion over said copper pillar and a second portion overhanging said copper pillar;
a solder metal between said nickel layer and said first surface, wherein said solder metal is joined with said ball grid array (BGA) substrate;
an underfill between said semiconductor device and said first surface, wherein said underfill contacts with said semiconductor device and said first surface and encloses said copper pillar and said solder metal; and
a contact ball on said second surface. - View Dependent Claims (2, 3, 4, 5)
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6. A chip package comprising:
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a substrate;
a semiconductor device comprising a passivation layer and a first pad exposed by an opening in said passivation layer;
a copper pillar between said first pad and said substrate, wherein said copper pillar has a height between 10 and 100 micrometers;
a barrier metal layer between said first pad and said copper pillar, wherein said barrier metal layer is on said first pad, over said passivation layer and in said opening;
a nickel layer between said copper pillar and said substrate, wherein said copper pillar has a transverse dimension smaller than that of said nickel layer, wherein said copper pillar has a first sidewall recessed from a second sidewall of said nickel layer, wherein a distance between said first sidewall and said second sidewall is greater than 0.2 micrometers, and wherein said nickel layer comprises a first portion over said copper pillar and a second portion overhanging said copper pillar;
a solder metal between said nickel layer and said substrate, wherein said solder metal is joined with said substrate; and
an underfill between said semiconductor device and said substrate, wherein said underfill contacts with said semiconductor device and said substrate and encloses said copper pillar and said solder metal. - View Dependent Claims (7, 8, 9, 10)
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11. A chip package comprising:
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a ball grid array (BGA) substrate having a first surface and a second surface opposite to said first surface;
a semiconductor device comprising a passivation layer and a first pad exposed by an opening in said passivation layer;
a copper pillar between said semiconductor device and said first surface, wherein said copper pillar is connected to said first pad through said opening, and wherein said copper pillar has a height between 10 and 100 micrometers;
a nickel layer between said copper pillar and said first surface, wherein said copper pillar has a transverse dimension smaller than that of said nickel layer, wherein said copper pillar has a first sidewall recessed from a second sidewall of said nickel layer, wherein a distance between said first sidewall and said second sidewall is greater than 0.2 micrometers, and wherein said nickel layer comprises a first portion over said copper pillar and a second portion overhanging said copper pillar;
a solder metal between said nickel layer and said first surface, wherein said solder metal is joined with said ball grid array (BGA) substrate;
an underfill between said semiconductor device and said first surface, wherein said underfill contacts with said semiconductor device and said first surface and encloses said copper pillar and said solder metal; and
a contact ball on said second surface. - View Dependent Claims (12, 13, 14, 15)
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16. A chip package comprising:
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a substrate;
a semiconductor device comprising a passivation layer and a first pad exposed by an opening in said passivation layer;
a copper pillar between said semiconductor device and said substrate, wherein said copper pillar is connected to said first pad through said opening, and wherein said copper pillar has a height between 10 and 100 micrometers;
a nickel layer between said copper pillar and said substrate, wherein said copper pillar has a transverse dimension smaller than that of said nickel layer, wherein said copper pillar has a first sidewall recessed from a second sidewall of said nickel layer, wherein a distance between said first sidewall and said second sidewall is greater than 0.2 micrometers, and wherein said nickel layer comprises a first portion over said copper pillar and a second portion overhanging said copper pillar;
a solder metal between said nickel layer and said substrate, wherein said solder metal is joined with said substrate; and
an underfill between said semiconductor device and said substrate, wherein said underfill contacts with said semiconductor device and said substrate and encloses said copper pillar and said solder metal. - View Dependent Claims (17, 18, 19, 20)
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Specification