METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION
First Claim
Patent Images
1. A multi-chip module with solder corrosion prevention comprising:
- one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board;
a quantity of molecular sieve desiccant; and
a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
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Abstract
Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
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Citations
15 Claims
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1. A multi-chip module with solder corrosion prevention comprising:
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one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board; a quantity of molecular sieve desiccant; and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 14, 15)
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7. A multi-chip module with solder corrosion prevention comprising:
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one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board; a first cover to contain the one or more chips and the substrate, the first cover having a seal to the printed circuit board; a heat sink disposed on a second face of the first cover opposite a first face of the first cover nearest to the one or more chips, the heat sink having a cavity facing a through opening in the cover; and a quantity of molecular sieve desiccant disposed in the cavity of the heat sink. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method of preventing corrosion of chip solder connections, comprising:
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sealing the chip in a chamber; positioning a molecular sieve inside the chamber with the chip; and adsorbing moisture within the chamber with the molecular sieve.
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Specification