Connecting Part of Conductor Pattern and Conductor Patterns-Connected Structure

• US 20080068272A1
• Filed: 09/19/2007
• Published: 03/20/2008
• Est. Priority Date: 09/20/2006
• Status: Active Grant

• Current Assignee: Lintec Corporation
• Original Assignee: Lintec Corporation
• Inventors: Matsushita, Taiga, Matsuura, Katsuyoshi, Katakura, Katumi
• Granted Patent: US 7,616,171 B2
• Time in Patent Office: Days
• US Class Current: 343/741
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4685 Manufacturing of cross-over conductors

Abstract

The present invention discloses:

• • a connecting part of conductor pattern, which is connected to a conductor pattern formed on a surface of an insulating substrate and which has at least one dent on the surface, and
  • a conductor patterns-connected structure obtained by electrically connecting the connecting parts of conductor patterns, mentioned above, to each other with a conductive material which fills the inside of the dent of each connecting part and further is adhered to each connecting part.

Claims

1. A connecting part of conductor pattern, which is connected to a conductor pattern formed on a surface of an insulating substrate and which has at least one dent on the surface.

2. A connecting part of conductor pattern according to claim 1, wherein the dent has an opening area of 0.03 mm² or more.

3. A conductor patterns-connected structure obtained by electrically connecting the connecting parts of conductor patterns, set forth in claim 1, to each other with a conductive material which fills the inside of the dent of each connecting part and further is adhered to each connecting part.

4. An antenna circuit having an insulating substrate and a surface circuit formed thereon, wherein the surface circuit comprising a plane coil circuit and at least one pair of opposed electrodes connected to the plane coil circuit, and the antenna circuit is having a connected structure set forth in claim 3.

5. An IC inlet having an antenna circuit set forth in claim 4 and an IC chip.

6. An IC tag having an IC inlet set forth in claim 5.