Dual laser separation of bonded wafers
First Claim
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1. A system for dicing a bonded wafer comprising:
- a plurality of substrates including at least a first substrate bonded to at least a second substrate;
a first laser configured to emit a first laser beam at a first predetermined wavelength, said first laser beam creates a modified layer within said first substrate and is transparent to said second substrate; and
a second laser configured to emit a second laser beam at a second predetermined wavelength, said second laser beam heats an inner portion of said second substrate creating a stress plane therein and is transparent to said first substrate.
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Abstract
A system for dicing a bonded wafer includes a plurality of substrates having at least a first substrate bonded to at least a second substrate. A first laser is configured to emit a first laser beam at a first predetermined wavelength such that the first laser beam creates a modified layer within the first substrate and is transparent to the second substrate. A second laser is configured to emit a second laser beam at a second predetermined wavelength such that the second laser beam heats an inner portion of the second substrate creating a stress plane therein and is transparent to the first substrate.
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Citations
27 Claims
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1. A system for dicing a bonded wafer comprising:
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a plurality of substrates including at least a first substrate bonded to at least a second substrate; a first laser configured to emit a first laser beam at a first predetermined wavelength, said first laser beam creates a modified layer within said first substrate and is transparent to said second substrate; and a second laser configured to emit a second laser beam at a second predetermined wavelength, said second laser beam heats an inner portion of said second substrate creating a stress plane therein and is transparent to said first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An apparatus for dicing a bonded wafer comprising:
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a first laser configured to emit a first laser beam at a predetermined wavelength; a second laser configured to emit a second laser beam at a second predetermined wavelength; at least one modulator in communication with said first and second lasers and configured to receive said first and second laser beams; wherein said first laser beam creates a modified layer within said first substrate and is transparent to said second substrate and wherein said second laser beam heats an inner portion of said second substrate creating a stress plane therein and is transparent to said first substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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24. A system for dicing a bonded wafer comprising:
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a means for forming a modified layer within at least a first substrate of the bonded wafer; a means for forming a stress plane within at least a second substrate of the bonded wafer; wherein said first substrate is unaffected by said means for forming a stress plane in said second substrate and said second substrate is unaffected by said means for forming a modified layer in said first substrate. - View Dependent Claims (25, 26, 27)
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Specification