Extensible robust modular electronic device without direct electrical connections for inter-module communication or control

• US 20080070500A1
• Filed: 11/20/2007
• Published: 03/20/2008
• Est. Priority Date: 03/27/2003
• Status: Active Grant

• Current Assignee: Robert Rapp
• Original Assignee: Robert Rapp
• Inventors: Rapp, Robert
• Granted Patent: US 7,727,035 B2
• Time in Patent Office: Days
• US Class Current: 455/41.1
• CPC Class Codes: G06F 1/16 Constructional details or arrangements
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: H05K 5/0021 Side-by-side or stacked arrangements
• CPC Class Codes: Y10S 439/95 Electrical connector adapted to transmit electricity to mating connector without physical contact, e.g. by induction, magnetism, or electrostatic field

Abstract

A modular electronic device where (predominantly) sealed modules are aligned and attached/connected in pre-determined sequences, forming a robust block-like structure with extendable function: Control and/or inter-module communication are implemented without direct electrical interconnect, by non-contact means such as (magnetic, inductive, light, infrared, radio frequency, sound, ultrasound, or other non-contact means). This device'"'"'s inter-module power transfer may be with or without direct electrical contact, or devices may be internally powered. Power transfer through inductive/transformer action where one or more alignment pins are used as transformer core is one potential implementation. Modules may be liquid filled to facilitate cooling and/or crush resistance to high-pressure environments.

Claims

1. :

A modular electronic device comprising;

A first electronic module including a first communication mechanism configured to facilitate transmission and reception of data communication input/output signals;

A second electronic module including a second communication mechanism configured to facilitate transmission and reception of data communication input/output signals with the first electronic module without direct electrical contact of data communication signals;

A third electronic module including a third communication mechanism configured to facilitate transmission and reception of data communication input/output signals between the modules without direct electrical contact of data communication signals.

An alignment attachment mechanism constructed to align and retain the modules relative together to one another;

Wherein the alignment attachment mechanism comprising one first protrusion and a corresponding recession one each of the first, second and third electronic modules; and

Wherein the protrusions physically engaging the recessions; and

Wherein the data communication input/output signals transmit and receive data communication signals between modules without electrical contact of data communication signals.

2. :

A modular electronic device as in claim 1 wherein the alignment attachment mechanism is constructed to rigidly retain the first, second, and third electronic modules together.

3. :

A modular electronic device as in claim 2 further comprising additional electronic modules, each including communication mechanisms configured to facilitate transmission and reception of data communication input/output signals without electrical contact of data communication signals.

4. :

A modular electronic device as in claim 3 wherein the alignment attachment mechanism comprising magnetic coupling from the first module to the second, from the second module to the third module, and between each subsequent electronic module, magnetically retaining the modules together.

5. :

A modular electronic device as in claim 3, wherein each of said modules further comprising without electrical contact electrical contact power transfer mechanisms.

6. :

A modular electronic device as in claim 4 wherein one or more magnets are arranged North Pole to South Pole forming a magnetic field gradient North Pole to South Pole across a surface of the first module; and

wherein one or more magnets in another module are also arranged North Pole to South Pole forming a magnetic field gradient North Pole to South Pole across a surface of the second module;

wherein the magnetic filed gradients in adjacent modules align in both Rotational and Linear dimensions then retain the modules together.

12. :

A modular electronic device as in claim 4 wherein one or more magnets are arranged North Pole to South Pole forming a magnetic field gradient North Pole to South Pole across a surface of the first module; and

wherein one or more magnets in another module are also arranged North Pole to South Pole forming a magnetic field gradient North Pole to South Pole across a surface of the second module;

wherein the magnetic filed gradients in adjacent modules align in both Rotational and Linear dimensions then retain the modules together.

18. :

A modular electronic device as in claim 4 wherein one or more magnets are arranged North Pole to South Pole forming a magnetic field gradient North Pole to South Pole across a surface of the first module; and

wherein one or more magnets in another module are also arranged North Pole to South Pole forming a magnetic field gradient North Pole to South Pole across a surface of the second module;

wherein the magnetic filed gradients in adjacent modules align in both Rotational and Linear dimensions then retain the modules together.

7. :

A modular electronic device comprising;

A first electronic module including a first communication mechanism configured to facilitate transmission and reception of data communication input/output signals;

A second electronic module including a second communication mechanism configured to facilitate transmission and reception of data communication input/output signals with the first electronic module without direct electrical contact of data communication signals;

A third electronic module including a third communication mechanism configured to facilitate transmission and reception of data communication input/output signals between the modules without direct electrical contact of data communication signals;

An alignment attachment mechanism constructed to align and retain the modules relative together to one another;

Wherein the alignment attachment mechanism comprising a plurality of first protrusions and corresponding recessions one each of the first, second and third electronic modules; and

Wherein the protrusions physically engaging the recessions; and

Wherein the data communication input/output signals transmit and receive data communication signals between modules without electrical contact of data communication signals, without transmitting or receiving the data communication signals through an alignment mechanism.

8. :

A modular electronic device as in claim 7 wherein the alignment attachment mechanism is constructed to rigidly retain the first, second, and third electronic modules together.

9. :

A modular electronic device as in claim 8 further comprising additional electronic modules, each including communication mechanisms configured to facilitate transmission and reception of data communication input/output signals without electrical contact of data communication signals.

10. :

A modular electronic device as in claim 9 wherein the alignment attachment mechanism comprising magnetic coupling from the first module to the second, from the second module to the third module, and between each subsequent electronic module, magnetically retaining the modules together.

11. :

A modular electronic device as in claim 10, wherein each said modules further comprising non-contact power transfer mechanisms.

13. :

A modular electronic device comprising;

A first electronic module including a first communication mechanism configured to facilitate transmission and reception of data communication input/output signals;

A second electronic module including a second communication mechanism configured to facilitate transmission and reception of data communication input/output signals with the first electronic module without direct electrical contact of data communication signals;

A third electronic module including a third communication mechanism configured to facilitate transmission and reception of data communication input/output signals between the modules without direct electrical contact of data communication signals.

A magnetic alignment attachment mechanism constructed to align and retain the modules relative together to one another without alignment protrusions;

Wherein the alignment attachment mechanism comprising at least one magnet in each module coupled to a magnetic material in an adjacent module; and

Wherein the data communication input/output signals transmit and receive data communication signals between modules without electrical contact of data communication signals;

14. :

A modular electronic device as in claim 13 further comprising additional electronic modules, each including communication mechanisms configured to facilitate transmission and reception of data communication input/output signals without electrical contact of data communication signals.

15. :

A modular electronic device as in claim 14 wherein the alignment attachment magnets align the electronic modules in both a Rotational and a Linear dimension.

16. :

A modular electronic device as in claim 14, wherein each said modules further comprising non-contact power transfer mechanisms.

17. :

A modular electronic device as in claim 14, wherein each said modules further comprising non-contact power transfer mechanisms.