FEED THROUGH INTERCONNECT ASSEMBLY FOR AN IMPLANTABLE STIMULATION SYSTEM AND METHODS OF MAKING AND USING

• US 20080071320A1
• Filed: 09/18/2006
• Published: 03/20/2008
• Est. Priority Date: 09/18/2006
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Advanced Bionics Corporation (Sonova Holding AG)
• Inventors: Brase, Randall Lee
• Granted Patent: US 8,224,450 B2
• Time in Patent Office: Days
• US Class Current: 607/37
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor

Abstract

A stimulation system includes an implantable pulse generator having a sealed chamber and an electronic subassembly disposed in the sealed chamber. Feed through pins are coupled to the electronic subassembly and extend out of the sealed chamber. Feed through interconnects are coupled to the electronic subassembly via the feed through pins. At least one tab is disposed on at least one feed through interconnect. The tab(s) are configured and arranged to flex away from the feed through interconnect and against a side of the feed through pin.

A feed through interconnect assembly includes an assembly frame; feed through interconnects extending from the assembly frame; a first contact pad and a second contact pad disposed on at least one of the feed through interconnects; and a tab formed on a first contact pad of at least one of the feed through interconnects.

Claims

1. A stimulation system comprising:

an implantable pulse generator comprising a sealed chamber and an electronic subassembly disposed in the sealed chamber;

a plurality of feed through pins coupled to the electronic subassembly and extending out of the sealed chamber;

a plurality of feed through interconnects coupled to the electronic subassembly via the feed through pins; and

at least one tab disposed on at least one feed through interconnect, wherein the at least one tab is configured and arranged to flex away from the feed through interconnect and against a side of the feed through pin.

2. The stimulation system of claim 1, further comprising a lead connector disposed on the implantable pulse generator and comprising a plurality of connector contacts.

3. The stimulation system of claim 1, further comprising at least one contact pad disposed on at least one of the feed through interconnects.

4. The stimulation system of claim 3, wherein the at least one tab is disposed on the at least one contact pad.

5. The stimulation system of claim 1, further comprising a lead connector disposed on the implantable pulse generator and comprising a plurality of connector contacts, wherein

a first contact pad and a second contact pad are disposed on at least one feed through interconnect;

the at least one tab is disposed on the first contact pad; and

the second contact pad is coupled to at least one of the connector contacts.

6. A feed through interconnect assembly comprising:

an assembly frame;

a plurality of feed through interconnects extending from the assembly frame;

a first contact pad and a second contact pad disposed on at least one of the feed through interconnects; and

a tab formed on a first contact pad of at least one of the feed through interconnects.

7. The feed through interconnect assembly of claim 6, wherein the tab is configured and arranged to flex away from the first contact pad.

8. The feed through interconnect assembly of claim 6, further comprising at least one indexing hole disposed on the assembly frame.

9. The feed through interconnect assembly of claim 6, wherein a tab is disposed on each first contact pad.

10. The feed through interconnect assembly of claim 6, wherein the assembly frame is removable.

11. The feed through interconnect assembly of claim 6, wherein the feed through interconnects are spaced apart at substantially uniform distances.

12. The feed through interconnect assembly of claim 6, further comprising at least one brace coupling the assembly frame to at least one feed through interconnect.

13. The feed through interconnect assembly of claim 12, wherein the at least one brace is removable.

14. The feed through interconnect assembly of claim 6, wherein the plurality of feed through interconnects extend from two opposite sides of the assembly frame.

15. The feed through interconnect assembly of claim 14, wherein the plurality of feed through interconnects extending from two opposite sides of the assembly frame are interleaved.

16. The feed through interconnect assembly of claim 6, wherein the plurality of feed through interconnects extend from two opposite sides of the assembly frame, and wherein a first brace couples at least one feed through interconnect extending from a first side of the assembly frame to the assembly frame and wherein a second brace couples at least one feed through interconnect extending from a second side of the assembly frame to the assembly frame.

17. A method of making a stimulation device comprising:

coupling a feed through interconnect assembly to a lead connector, wherein the feed through interconnect assembly comprises an assembly frame, a plurality of feed through interconnects extending from the assembly frame, a first contact pad and a second contact pad disposed on at least one of the feed through interconnects, and a tab formed on a first contact pad of at least one of the feed through interconnects; and

coupling the feed through interconnect assembly to an implantable pulse generator comprising a sealed chamber, an electronic subassembly disposed in the sealed chamber, and a plurality of feed through pins coupled to the electronic subassembly and extending through the sealed chamber.

18. The method of making a stimulation device of claim 17, further comprising removing the assembly frame of the feed through interconnect assembly.

19. The method of making a stimulation device of claim 17, wherein the feed through interconnect assembly further comprises at least one brace coupling the assembly frame to at least one feed through interconnect, and wherein the method of making a stimulation device further comprises removing the at least one brace.

20. The method of making a stimulation device of claim 17, wherein coupling the feed through interconnect assembly to the implantable pulse generator comprises coupling the tabs of the feed through interconnect assembly to the feed through pins of the implantable pulse generator.