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Die-level traceability mechanism for semiconductor assembly and test facility

  • US 20080071413A1
  • Filed: 10/31/2007
  • Published: 03/20/2008
  • Est. Priority Date: 10/15/2004
  • Status: Abandoned Application
First Claim
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1. A method for maintaining die information during manufacturing operations, comprising:

  • storing, in a database, one or more die strings identifying one or more die units, wherein the die units are at least one of a first set of die units associated with a source object, a second set of die units which have transferred from the source object to a receiving object, and a third set of die units which are die units remaining at the source object after the second set of die units have transferred from the source object to the receiving object;

    storing, in the database, an assignment of a first index string to one or more die strings identifying the first set of die units associated with the source object;

    storing, in the database, an assignment of a second index string to one or more die strings identifying the second set of die units which have transferred from the source object to the receiving object;

    storing, in the database, a third index string reflecting one or more die strings identifying the third set of die units, wherein the third set of die units are the die units remaining at the source object after the transfer of the second set of die units from the source object to the receiving object; and

    storing, in the database, an association of the third index string to the die strings identifying the third set of die units remaining at the source object.

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