SMALL VOLUME SYMMETRIC FLOW SINGLE WAFER ALD APPARATUS

• US 20080072821A1
• Filed: 07/20/2007
• Published: 03/27/2008
• Est. Priority Date: 07/21/2006
• Status: Abandoned Application

• Current Assignee: Aixtron Inc. (Aixtron AG)
• Original Assignee: Aixtron Inc. (Aixtron AG)
• Inventors: Doering, Kenneth, Seidel, Thomas, Dalton, Jeremic, Strauch, Gerhard, Karim, M., Dauelsberg, Martin
• Application Number:
  US11/780,698
• Publication Number:
  US 20080072821A1
• Time in Patent Office: Days
• US Class Current: 118/715
• CPC Class Codes: C30B 25/14 Feed and outlet means for the gases; Modifying the flow of the reactive gases
• CPC Class Codes: C30B 35/00 Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure

Abstract

A reaction chamber apparatus includes a vertically movable heater-susceptor with an attached annular attached flow ring that performs as a gas conduit. The outlet port of the flow ring extends below the bottom of a wafer transport slot valve when the susceptor is in its process (higher) position, while the gas conduit formed by the flow ring has an external surface at its edge that isolates the outer space of the reactor above the wafer from the confined reaction space. In some cases, the outer edge of the gas conduit is in proximity to a ring attached to the reactor lid and, together, the ring and conduit act as a tongue-in-groove (TIG) configuration. In some cases, the TIG design may have a staircase contour, thereby limiting diffusion-backflow of downstream gases to the outer space of the reactor.

Claims

1. A reaction chamber apparatus comprising a vertically movable heater-susceptor coupled to an annular flow ring configured as a gas conduit and having an outlet port extending below a bottom of a wafer transport slot valve of the reaction chamber apparatus when the heater-susceptor is in a processing position.

2. A reaction chamber apparatus comprising a heater-susceptor coupled to an annular flow ring conduit at a perimeter of the heater-susceptor, the flow ring conduit having an external surface at its edge, the external surface configured to isolate an outer space of the reactor both above and below a wafer position when the heater-susceptor is in a processing position.

3. A reaction chamber apparatus comprising a heater-susceptor coupled to an annular flow ring conduit at a perimeter of the heater-susceptor, the annular flow ring defined by inner and outer members and configured to isolate an outer space of the reaction chamber above a wafer position from a confined reaction space of the reaction chamber when the heater-susceptor is in a processing position, in which instance the outer member of the annular flow ring is in proximity with a second annular ring attached to a lid of the reactor, the outer member of the annular flow ring and the second annular ring forming a tongue-in-groove (TIG) configuration.

4. The reaction chamber apparatus of claim 3, wherein the TIG configuration comprises a staircase contour, operable to limit diffusion-backflow of downstream gases to an outer space of the reaction chamber apparatus.

5. The reaction chamber apparatus of claim 3, further comprising a pump coupled to remove gas streams from the reaction chamber, the annular flow ring conduit and a lower chamber leading to the pump.

6. The reaction chamber apparatus of claim 5, further comprising a gas injection orifice coupled to permit by-passing of the reaction chamber and the flow ring conduit such that gas injected through said orifice enters into a stream leading to the pump below an output orifice of the flow ring.

7. The reaction chamber apparatus of claim 6, wherein the gas injection orifice is configured such that gas is injected at azimuthal points.

8. The reaction chamber apparatus of claims 6, wherein the flow ring orifice includes restrictors in the form of holes at a plane of the orifice.

9. The reaction chamber apparatus of claim 8, wherein the holes are configured differently in different azimuthal directions.

10. The reaction chamber apparatus of claim 3, wherein an inner edge of the lid is curved.

11. A reaction chamber apparatus comprising a vertically movable susceptor coupled to an annular flow ring conduit at a perimeter of the susceptor, said annular flow ring conduit configured to pass reaction gas effluent to a downstream pump that is located off-axis with respect to an axi-centric center of the reaction chamber.

12. The reaction chamber apparatus of claim 11, further comprising a downstream baffle located between a lower orifice of the annular flow ring and the downstream pump.

13. The reaction chamber apparatus of claim 11, further comprising a second annular ring attached to a lid of the reaction chamber apparatus, the second annular ring being in proximity to an outer member of the annular flow ring conduit when the vertically movable susceptor is in a process position, the second annular ring and the outer member of the annular flow ring conduit forming a tongue-in-groove (TIG) configuration.

14. The reaction chamber apparatus of claim 13, wherein the second annular ring is an inner lid ring and further comprising an outer lid ring surrounding the TIG configuration formed by the second annular ring and the outer member of the annular flow ring conduit when the vertically movable susceptor is in the process position.

15. The reaction chamber apparatus of claim 13, wherein a joint between the second annular ring and the lid is curved.

16. The reaction chamber apparatus of claim 13, wherein a joint between the second annular ring and the lid is filleted.

17. The reaction chamber apparatus of claim 13, wherein the TIG configuration comprises a staircase.

18. The reaction chamber apparatus of claim 17, wherein the second annular ring is an inner lid ring and further comprising an outer lid ring surrounding the TIG configuration formed by the second annular ring and the outer member of the annular flow ring conduit when the vertically movable susceptor is in the process position.

19. The reaction chamber apparatus of claim 18, wherein a joint between the second annular ring and the lid is curved.

20. The reaction chamber apparatus of claim 13, wherein a joint between the second annular ring and the lid is filleted.