Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
First Claim
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1. A semiconductor device comprising a semiconductor chip having a plurality of pads;
- a metal layer disposed on each of the pads;
a plurality of leads; and
a soldering or brazing material disposed between the metal layer and one of the leads, wherein the metal layer is bonded to one of the leads through the soldering or brazing material, wherein at least one depression is formed in a side of the metal layer in the view from which a cross section parallel to each of the pads is taken, and the soldering or brazing material is put in the depression.
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Abstract
A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.
28 Citations
8 Claims
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1. A semiconductor device comprising
a semiconductor chip having a plurality of pads; -
a metal layer disposed on each of the pads;
a plurality of leads; and
a soldering or brazing material disposed between the metal layer and one of the leads, wherein the metal layer is bonded to one of the leads through the soldering or brazing material, wherein at least one depression is formed in a side of the metal layer in the view from which a cross section parallel to each of the pads is taken, and the soldering or brazing material is put in the depression. - View Dependent Claims (3, 5, 7)
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2. A semiconductor device comprising:
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a semiconductor chip that has a plurality of pads;
a metal layer that is disposed on each of the pads;
a plurality of leads; and
a soldering or brazing material that is disposed between the metal layer and one of the leads, wherein the metal layer is bonded to one of the leads through the soldering or brazing material, wherein at least one depression is formed in a side of the metal layer in the top view of the metal layer, and the soldering or brazing material is put in the depression. - View Dependent Claims (4, 6, 8)
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Specification