METHODS OF CONNECTING AN ANTENNA TO A TRANSPONDER CHIP

• US 20080073800A1
• Filed: 08/01/2007
• Published: 03/27/2008
• Est. Priority Date: 09/26/2006
• Status: Active Grant

• Current Assignee: Assa Abloy AB, HID Global GmbH (Assa Abloy AB)
• Original Assignee: ADVANCED MICROELECTRONIC AND AUTOMATION TECHNOLOGY LTD.
• Inventors: Finn, David
• Granted Patent: US 8,240,022 B2
• Time in Patent Office: Days
• US Class Current: 257/784
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base

Abstract

A transponder chip or chip module in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions spanning the recess. The end portions are spaced wider than the chip, to allow the chip to be inserted into the recess from the same side as the antenna. The chip may be moved in the recess so that its terminals are under the wires, or the wires may be repositioned to be over the terminals, for bonding thereto. Prior to installing the chip in the recess, insulation may be removed from the end portions of the antenna wire, which may also be flattened to improve bonding.

Claims

1. Method of connecting an antenna wire to a transponder chip comprising:

providing a recess in a surface of a substrate;

mounting the antenna wire to the surface of the substrate so that two end portions of the antenna wire span the recess;

characterized by;

installing the transponder chip in the recess, past the end portions of the antenna wire; and

subsequently bonding the end portions of the antenna wire to corresponding terminals of the transponder chip.

2. The method of claim 1, further comprising:

removing insulation from the end portions of the antenna wire.

3. The method of claim 1, further comprising:

flattening the end portions of the antenna wire.

4. The method of claim 1, further comprising:

prior to bonding, rotating the transponder chip in the recess to bring the terminals into alignment with the end portions of the antenna wire.

5. The method of claim 1, further comprising:

prior to bonding, repositioning the end portions of the antenna wire to be in alignment with the terminals of the transponder chip.

6. The method of claim 1, wherein:

the two end portions of the antenna wire are spaced a distance apart which is greater than at least one of the cross dimensions of the transponder chip; and

the distance is substantially equal to a spacing between the terminals of the transponder chip.

7. The method of claim 1, wherein:

the two end portions of the antenna wire are initially spaced a distance apart which is greater than at least one of the cross dimensions of the transponder chip;

prior to bonding, the end portions of the antenna wire are repositioned so that the distance between the two end portions of the antenna wire is substantially equal to a spacing between the terminals of the transponder chip.