TILE SUB-ARRAY AND RELATED CIRCUITS AND TECHNIQUES
First Claim
Patent Images
1. A tile subarray comprising:
- a lower multi-layer assembly (LMLA) having a first surface with a plurality of packageless T/R modules electrically coupled thereto;
a first interconnect board disposed over the plurality of T/R modules;
a circulator board, disposed over said interconnect board;
a second interconnect board disposed over said circulator board; and
an upper multi-layer assembly (UMLA) disposed over said second interconnect board.
1 Assignment
0 Petitions
Accused Products
Abstract
A radiator includes a waveguide having an aperture and a patch antenna disposed in the aperture. In one embodiment, an antenna includes an array of waveguide antenna elements, each element having a cavity, and an array of patch antenna elements including an upper patch element and a lower patch element disposed in the cavity.
-
Citations
10 Claims
-
1. A tile subarray comprising:
-
a lower multi-layer assembly (LMLA) having a first surface with a plurality of packageless T/R modules electrically coupled thereto; a first interconnect board disposed over the plurality of T/R modules; a circulator board, disposed over said interconnect board; a second interconnect board disposed over said circulator board; and an upper multi-layer assembly (UMLA) disposed over said second interconnect board. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A tile sub-array comprising:
-
an upper multi-layer assembly (UMLA) comprised of a first plurality of printed circuit boards; a lower multi-layer assembly (LMLA) coupled to said UMLA, said LMLA comprised of a second plurality of printed circuit boards; each of said UMLA and said LMLA comprising one or more RF interconnects, with each of said one or more RF interconnects providing at least one RF signal path between a first transmission line on a first layer of one of said first and second plurality of printed circuit boards and a second transmission line on a second different layer of one of said first and second plurality of printed circuit boards with each of said RF interconnects including one or more RF matching pads which electrically match one or more electrical characteristics of an RF stub formed in said RF interconnect. - View Dependent Claims (8, 9, 10)
-
Specification