Heat pipe structure

• US 20080074844A1
• Filed: 09/25/2006
• Published: 03/27/2008
• Est. Priority Date: 09/25/2006
• Status: Abandoned Application

• Current Assignee: Been-Yu Liaw
• Original Assignee: Been-Yu Liaw
• Inventors: Liaw, Been-Yu
• Application Number:
  US11/526,079
• Publication Number:
  US 20080074844A1
• Time in Patent Office: Days
• US Class Current: 361/702
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28F 1/24 and extending transversely F28F1/38 takes precedence
• CPC Class Codes: F28F 13/00 Arrangements for modifying heat-transfer, e.g. increasing, decreasing F28F1/00 - F28F11/00 take precedence
• CPC Class Codes: F28F 2255/16 extruded

Abstract

A heat pipe structure is composed of a heat pipe, a heat dissipation plate, a heat source member, and screws, wherein the heat pipe is transfixed into the heat dissipation plate, heated, and extruded, such that an end of the heat pipe is molten at a slant cut of the heat dissipation plate, enabling the heat dissipation plate and the heat pipe to be molten into one body. Next, the heat dissipation plate and the heat pipe are processed with a CNC (Computer Numerical Control) machine to form into a complete plane, and the screws are used to lock the heat source member on the heat dissipation plate, such that heat energy is effectively absorbed by the heat transmission structure, and is transmitted out through the heat pipe.

Claims

1. A heat pipe structure comprising a heat pipe, which is used to transmit heat energy generated by a heat source member, and an end of which is provided with a seal;

a heat dissipation plate, which is used to absorb the heat energy generated by the heat source member, is transfixed with the heat pipe, and a surface of which is opened with a plurality of screw-holes;

the heat source member, which is installed on the heat pipe and the heat dissipation plate, transmits the heat source through a contact surface between the heat pipe and the heat dissipation plate, and is provided with a plurality of through-holes which are corresponding to the plurality of screw-holes; and

a plurality of screws, which are transfixed into the plural through-holes of heat source member, and are locked into the plural screw-holes on the heat dissipation plate for being tightly fixed.

2. The heat pipe structure according to claim 1, wherein the heat pipe is transfixed into the heat dissipation plate, heated, and extruded, such that an end of the heat pipe is molten at a slant cut of the heat dissipation plate, thereby enabling the heat pipe and the heat dissipation plate to be formed into a plane, in order to achieve the best heat transmission effect.

3. The heat pipe structure according to claim 2, wherein the plane is further processed with a CNC (Computer Numerical Control) machine, a lathe, a punch, an electroforming machine, a laser machine, an electric discharge machine, an injection molding machine, and other related method or device that is used to increase a smoothness of the plane.

4. The heat pipe structure according to claim 1, wherein a heat transmission block is further installed between the heat dissipation plate and the heat pipe, in order to increase a passage of heat transmission from absorption of the heat source by the heat dissipation plate to the heat pipe.

5. The heat pipe structure according to claim 4, wherein the heat transmission block includes a plurality of screw-holes which provide for a locking of an externally connected heat dissipation device and a device with heat of which being dissipated.

6. The heat pipe structure according to claim 1, wherein the other end of the heat pipe is further provided with fins, such that the heat transmission structure dissipates effectively the heat source absorbed.

7. The heat pipe structure according to claim 1, wherein the heat source member is further an integrated circuit, a CPU (Central Processing Unit), a storage device, an illumination device, a transformer, and other related device that generates heat.

8. The heat pipe structure according to claim 1, wherein the heat dissipation plate is further made by a copper material, an aluminum material, an alloy material, a ceramic material, and other material that is provided with a high heat transmission effect.

9. The heat pipe structure according to claim 4, wherein the heat pipe is further made by a copper material, an aluminum material, an alloy material, a ceramic material, and other material that is provided with a high heat transmission effect.