SILICON CONDENSER MICROPHONE

• US 20080075308A1
• Filed: 08/30/2006
• Published: 03/27/2008
• Est. Priority Date: 08/30/2006
• Status: Abandoned Application

• Current Assignee: Merry Electronics Company Limited
• Original Assignee: Merry Electronics Company Limited
• Inventors: Jeng, Cyuan-Sian, Her, Hong-Ching, Gong, Shih-Chin, Wei, Wen-Chieh
• Application Number:
  US11/468,658
• Publication Number:
  US 20080075308A1
• Time in Patent Office: Days
• US Class Current: 381/175
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 3/001 Structures having a reduced contact area, e.g. with bumps or with a textured surface
• CPC Class Codes: H04R 19/005 using semiconductor materials

Abstract

A silicon condenser microphone includes a silicon substrate defining an air chamber, a back plate mounted on the silicon substrate, a diaphragm arranged between the silicon substrate and the back plate and a suspension device arranged between the diaphragm and the silicon substrate. The back plate includes at least one acoustic aperture defined therein and a support device formed thereon. The diaphragm is arranged between the silicon substrate and the back plate so that an effective area thereof is determined by the support device. The suspension device is arranged between the diaphragm and the silicon substrate so that lateral movement of the diaphragm is prevented while vertical movement of the diaphragm is allowed. An edge of the diaphragm is abutted against the support device when the diaphragm is moved towards the back plate.

Claims

1. A silicon condenser microphone comprising:

a silicon substrate defining an air chamber;

a back plate mounted on the silicon substrate, the back plate comprising at least one acoustic aperture defined therein and a support device formed thereon;

a diaphragm arranged between the silicon substrate and the back plate so that an effective area thereof is determined by the support device; and

a suspension device arranged between the diaphragm and the silicon substrate so that lateral movement of the diaphragm is prevented while vertical movement of the diaphragm is allowed;

wherein an edge of the diaphragm is abutted against the support device when the diaphragm is moved towards the back plate.

2. The silicon condenser microphone according to claim 1 wherein the back plate comprises an anti-sticking device for avoid the sticking of the diaphragm to the back plate.

3. The silicon condenser microphone according to claim 1 wherein the anti-sticking device comprises a plurality of bosses made of a dielectric material.

4. The silicon condenser microphone according to claim 1 wherein the support device comprises an annular ridge.

5. The silicon condenser microphone according to claim 4 wherein the annular ridge is made of a dielectric material.

6. The silicon condenser microphone according to claim 1 wherein the support device comprises a plurality of bosses.

7. The silicon condenser microphone according to claim 6 wherein the bosses are arranged along a circle.

8. The silicon condenser microphone according to claim 6 wherein the bosses are made of a dielectric material.

9. The silicon condenser microphone according to claim 1 wherein the suspension device comprises at least one corrugated cantilever for supporting the diaphragm on the silicon substrate, thus allowing the vertical movement of the diaphragm while avoiding the lateral movement of the diaphragm.

10. The silicon condenser microphone according to claim 1 wherein the diaphragm is made of poly-crystalline silicon.

11. A silicon condenser microphone comprising:

a silicon substrate defining an air chamber;

a back plate mounted on the silicon substrate, the back plate comprising at least one acoustic aperture defined therein;

a diaphragm arranged between the silicon substrate and the back plate; and

a suspension device arranged between the diaphragm and the silicon substrate so that lateral movement of the diaphragm is prevented while vertical movement of the diaphragm is allowed;

wherein an edge of the diaphragm is abutted against the support device when the diaphragm is moved towards the back plate.

12. The silicon condenser microphone according to claim 11 wherein the suspension device comprises at least one corrugated cantilever for supporting the diaphragm on the silicon substrate, thus allowing the vertical movement of the diaphragm while avoiding the lateral movement of the diaphragm.

13. The silicon condenser microphone according to claim 11 wherein the diaphragm is made of poly-crystalline silicon.

14. The silicon condenser microphone according to claim 11 wherein the back plate comprises an anti-sticking device for avoiding the sticking of the diaphragm to the back plate.

15. The silicon condenser microphone according to claim 14 wherein the anti-sticking device comprises a plurality of bosses made of a dielectric material.