Coating Package for an Implantable Device

• US 20080077194A1
• Filed: 10/28/2007
• Published: 03/27/2008
• Est. Priority Date: 03/24/1999
• Status: Active Grant

• Current Assignee: Second Sight Medical Products, Inc. (Vivani Medical, Inc.)
• Original Assignee: Second Sight Medical Products, Inc. (Vivani Medical, Inc.)
• Inventors: Greenberg, Robert, Schulman, Joseph
• Granted Patent: US 8,355,800 B2
• Time in Patent Office: Days
• US Class Current: 607/54
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/36046 of the eye
• CPC Class Codes: A61N 1/37247 User interfaces, e.g. input or presentation means
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

The present invention is an implantable electronic device formed within a biocompatible hermetic package. Preferably the implantable electronic device is used for a visual prosthesis for the restoration of sight in patients with lost or degraded visual function. The package is formed from a thin film of hermetic biocompatible material to minimize the size of the implanted device.

Claims

1. An implantable device comprising:

an integrated circuit chip;

electrodes on at least one surface of said integrated circuit chip; and

insulation deposited on said integrated circuit chip forming voids over said electrodes.

2. The implantable device according to claim 1, wherein said insulator in Alumina.

3. The implantable device according to claim 1, wherein said insulator in Zirconia.

4. The implantable device according to claim 1, wherein said insulator is deposited by Ion-beam assisted deposition.

5. The implantable device according to claim 1, wherein said insulator partially covers said electrodes.

6. The implantable device according to claim 5, further comprising an adhesion layer between said electrode and said insulator.

7. The implantable device according to claim 6, wherein said adhesion layer is titanium.

8. The implantable device according to claim 7, wherein said adhesion layer is a titanium ring.

9. The implantable device according to claim 1, wherein said electrodes are platinum.

10. The implantable device according to claim 9, wherein said electrodes are platinum foil

11. An implantable device comprising:

an electronic circuit including electrodes; and

a hermetic coating over said electronic circuit forming voids at said electrodes.

12. The implantable device according to claim 11, wherein said hermetic coating comprises silicon carbide.

13. The implantable device according to claim 11, wherein said hermetic coating comprises diamond-like coating.

14. The implantable device according to claim 11, wherein said hermetic coating comprises silicon nitride.

15. The implantable device according to claim 11, wherein said hermetic coating comprises silicon nitride.

16. The implantable device according to claim 11, wherein said hermetic coating comprises silicon oxide.

17. The implantable device according to claim 11, wherein said hermetic coating comprises titanium oxide.

18. The implantable device according to claim 11, wherein said hermetic coating comprises tantalum oxide.

19. The implantable device according to claim 11, wherein said hermetic coating comprises aluminum nitride.

20. The implantable device according to claim 11, wherein said hermetic coating comprises zirconium oxide.