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Coating Package for an Implantable Device

  • US 20080077194A1
  • Filed: 10/28/2007
  • Published: 03/27/2008
  • Est. Priority Date: 03/24/1999
  • Status: Active Grant
First Claim
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1. An implantable device comprising:

  • an integrated circuit chip;

    electrodes on at least one surface of said integrated circuit chip; and

    insulation deposited on said integrated circuit chip forming voids over said electrodes.

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