Coating Package for an Implantable Device
First Claim
Patent Images
1. An implantable device comprising:
- an integrated circuit chip;
electrodes on at least one surface of said integrated circuit chip; and
insulation deposited on said integrated circuit chip forming voids over said electrodes.
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Abstract
The present invention is an implantable electronic device formed within a biocompatible hermetic package. Preferably the implantable electronic device is used for a visual prosthesis for the restoration of sight in patients with lost or degraded visual function. The package is formed from a thin film of hermetic biocompatible material to minimize the size of the implanted device.
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Citations
20 Claims
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1. An implantable device comprising:
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an integrated circuit chip;
electrodes on at least one surface of said integrated circuit chip; and
insulation deposited on said integrated circuit chip forming voids over said electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An implantable device comprising:
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an electronic circuit including electrodes; and
a hermetic coating over said electronic circuit forming voids at said electrodes. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification