HEAT DISSIPATING DEVICE

• US 20080078187A1
• Filed: 12/09/2006
• Published: 04/03/2008
• Est. Priority Date: 09/29/2006
• Status: Abandoned Application

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: YE, ZHEN-XING, CHEN, MING-KE
• Application Number:
  US11/608,805
• Publication Number:
  US 20080078187A1
• Time in Patent Office: Days
• US Class Current: 62/3.7
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/021 Control thereof
• CPC Class Codes: F25B 2321/0211 of fans
• CPC Class Codes: F25B 2321/0251 by a gas
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipating device for an electronic element includes a thermoelectric cooler (TEC) attached to the heat conductor, a heat sink attached on the TEC, a fan attached on the heat sink, and a temperature control circuit. The TEC absorbs heat from the electronic element, and transfers the heat to the heat sink. The temperature control circuit receives a rotation speed signal from the fan, when rotation speed of the fan is higher than a given level, the temperature control circuit controls the TEC to cool the electronic element, when rotation speed is lower than the given level, the temperature control circuit controls the TEC to stop cooling the electronic element.

Claims

1. A heat dissipating device for an electronic element, the heat dissipating device comprising:

a thermoelectric cooler (TEC) configured for absorbing heat from the electronic element;

a heat sink attached on the TEC for dissipating heat from the TEC;

a fan attached on the heat sink for accelerating heat dissipation of the heat sink, and being capable of changing rotation speed thereof according to temperature of the electronic element; and

a temperature control circuit receiving a rotation speed signal from the fan, when rotation speed of the fan is higher than a given level, the temperature control circuit controls the TEC to cool the electronic element, when rotation speed is lower than the given level, the temperature control circuit controls the TEC to stop cooling the electronic element.

2. The heat dissipating device as claimed in claim 1, wherein the temperature control circuit comprises a first power terminal, a micro control unit (MCU), and a relay comprising an inductance coil and a switch, an input terminal of the MCU is electrically connected to a rotation speed signal output terminal of the fan for receiving the rotation speed signal from the fan, an output terminal of the MCU is electrically connected to ground via the inductance coil of the relay, the first power terminal is connected to a terminal of the TEC via the switch of the relay, another terminal of the TEC is grounded.

3. The heat dissipating device as claimed in claim 2, wherein the temperature control circuit further comprises a second power terminal, a first resistor, a second resistor, and another switch, another input terminal of the MCU is electrically connected to the second power terminal via the second resistor, and electrically connected to ground via the first resistor and the another switch in parallel.

4. The heat dissipating device as claimed in claim 3, wherein the another switch is a push-button switch.

5. The heat dissipating device as claimed in claim 2, wherein the temperature control circuit further comprises an indicator for indicating the working status of the TEC, another output terminal of the MCU is electrically connected to ground via the indicator.

6. The heat dissipating device as claimed in claim 5, wherein the indicator is a light-emitting diode (LED).

7. The heat dissipating device as claimed in claim 1, further comprising a heat conductor configured to contact the electronic element for collecting heat therefrom, wherein the TEC is attached on the heat conductor and the heat conductor is a solid metal cube.

12. The heat dissipating device as claimed in claim 1, wherein the first power terminal is connected to a +12V power source of a circuit board on which the electronic element is attached, and the second power terminal is connected to a +3.3V power source of the circuit board.

8. A heat dissipating device for an electronic element, the heat dissipating device comprising:

a heat conductor configured to attach to the electronic element for absorbing heat therefrom;

a thermoelectric cooler (TEC) attached to the heat conductor for cooling the electronic element via the heat conductor; and

a temperature control circuit detecting temperature of the electronic element, when temperature of the electronic element is higher than a given value, the temperature control circuit controlling the TEC to cool the electronic element, when temperature of the electronic element is lower than the given value, the temperature control circuit controlling the TEC to stop cooling the electronic element.

9. The heat dissipating device as claimed in claim 8, further comprising:

a heat sink attached on the TEC for absorbing heat of the TEC; and

a fan attached to the heat sink for transferring the heat from the heat sink to outside.

10. The heat dissipating device as claimed in claim 8, wherein the temperature control circuit comprises a first power terminal, a micro control unit (MCU), and a relay comprising an inductance coil and a switch, an input terminal of the MCU is electrically connected to a temperature signal pin of the electronic element for detecting a temperature of the electronic element, an output terminal of the MCU is electrically connected to ground via the inductance coil of the relay, the first power terminal is connected to a terminal of the TEC via the switch of the relay, another terminal of the TEC is grounded.

11. The heat dissipating device as claimed in claim 10, wherein the temperature control circuit further comprises a second power terminal, a first resistor, a second resistor, and another switch, another input terminal of the MCU is electrically connected to the second power terminal via the second resistor, and electrically connected to ground via the first resistor and the another switch, which are connected in parallel.

13. The heat dissipating device as claimed in claim 11, wherein the switch is a push-button switch.

14. The heat dissipating device as claimed in claim 10, wherein the temperature control circuit further comprises an indicator for indicating the working status of the TEC, another output terminal of the MCU is electrically connected to ground via the indicator.

15. The heat dissipating device as claimed in claim 14, wherein the indicator is a light-emitting diode (LED).

16. A heat dissipating device comprising:

a heat conductor attached on an electronic element for absorbing heat therefrom;

a thermoelectric cooler (TEC) attached on the heat conductor for cooling the electronic element via the heat conductor;

a heat sink attached on the TEC in such a manner that the TEC is sandwiched between the heat conductor and the heat sink;

a fan attached to the heat sink and being capable of changing rotation speed thereof according to temperature of the electronic element; and

a control circuit configured for controlling the TEC to turn on or off according to the temperature of the electronic element.

17. The heat dissipating device as claimed in claim 16, wherein when temperature of the electronic element is higher than a given value, the control circuit controls the TEC to turn on to cool the electronic element, and when the temperature of the electronic element is lower than the given value the control circuit controls the TEC to turn off to stop cooling the electronic element.

18. The heat dissipating device as claimed in claim 17, wherein the fan is capable of adjusting its rotation speed between a lower level and a higher level, when the temperature of the electronic element is higher than the given value, the rotation speed of the fan is at the higher level and when the temperature of the electronic element is lower than the given value, the rotation speed of the fan is at the lower level.

19. The heat dissipating device as claimed in claim 18, wherein the control circuit comprises a micro control unit (MCU) which is electrically connected to the fan for receiving a rotation speed signal from the fan, and a relay connected to an output terminal of the MCU, the relay being electrically connected between a power source and the TEC for controlling the TEC to turn on or off according to the rotation speed signal of the fan.

20. The heat dissipating device as claimed in claim 18, wherein the control circuit comprises a micro control unit (MCU) which is electrically connected to the electronic element for detecting the temperature of the electronic element, and a relay connected to an output terminal of the MCU, the relay being electrically connected between a power source and the TEC for controlling the TEC to turn on or off according to the detected temperature.