HEAT DISSIPATING DEVICE
First Claim
1. A heat dissipating device for an electronic element, the heat dissipating device comprising:
- a thermoelectric cooler (TEC) configured for absorbing heat from the electronic element;
a heat sink attached on the TEC for dissipating heat from the TEC;
a fan attached on the heat sink for accelerating heat dissipation of the heat sink, and being capable of changing rotation speed thereof according to temperature of the electronic element; and
a temperature control circuit receiving a rotation speed signal from the fan, when rotation speed of the fan is higher than a given level, the temperature control circuit controls the TEC to cool the electronic element, when rotation speed is lower than the given level, the temperature control circuit controls the TEC to stop cooling the electronic element.
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Accused Products
Abstract
A heat dissipating device for an electronic element includes a thermoelectric cooler (TEC) attached to the heat conductor, a heat sink attached on the TEC, a fan attached on the heat sink, and a temperature control circuit. The TEC absorbs heat from the electronic element, and transfers the heat to the heat sink. The temperature control circuit receives a rotation speed signal from the fan, when rotation speed of the fan is higher than a given level, the temperature control circuit controls the TEC to cool the electronic element, when rotation speed is lower than the given level, the temperature control circuit controls the TEC to stop cooling the electronic element.
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Citations
20 Claims
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1. A heat dissipating device for an electronic element, the heat dissipating device comprising:
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a thermoelectric cooler (TEC) configured for absorbing heat from the electronic element; a heat sink attached on the TEC for dissipating heat from the TEC; a fan attached on the heat sink for accelerating heat dissipation of the heat sink, and being capable of changing rotation speed thereof according to temperature of the electronic element; and a temperature control circuit receiving a rotation speed signal from the fan, when rotation speed of the fan is higher than a given level, the temperature control circuit controls the TEC to cool the electronic element, when rotation speed is lower than the given level, the temperature control circuit controls the TEC to stop cooling the electronic element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 12)
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8. A heat dissipating device for an electronic element, the heat dissipating device comprising:
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a heat conductor configured to attach to the electronic element for absorbing heat therefrom; a thermoelectric cooler (TEC) attached to the heat conductor for cooling the electronic element via the heat conductor; and a temperature control circuit detecting temperature of the electronic element, when temperature of the electronic element is higher than a given value, the temperature control circuit controlling the TEC to cool the electronic element, when temperature of the electronic element is lower than the given value, the temperature control circuit controlling the TEC to stop cooling the electronic element. - View Dependent Claims (9, 10, 11, 13, 14, 15)
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16. A heat dissipating device comprising:
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a heat conductor attached on an electronic element for absorbing heat therefrom; a thermoelectric cooler (TEC) attached on the heat conductor for cooling the electronic element via the heat conductor; a heat sink attached on the TEC in such a manner that the TEC is sandwiched between the heat conductor and the heat sink; a fan attached to the heat sink and being capable of changing rotation speed thereof according to temperature of the electronic element; and a control circuit configured for controlling the TEC to turn on or off according to the temperature of the electronic element. - View Dependent Claims (17, 18, 19, 20)
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Specification