Heat dissipating system and method

• US 20080078202A1
• Filed: 05/14/2007
• Published: 04/03/2008
• Est. Priority Date: 09/28/2006
• Status: Abandoned Application

• Current Assignee: Chin-Kuang Luo
• Original Assignee: Chin-Kuang Luo
• Inventors: Luo, Chin-Kuang
• Application Number:
  US11/798,434
• Publication Number:
  US 20080078202A1
• Time in Patent Office: Days
• US Class Current: 62/485
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction

Abstract

A heat dissipating system includes: a heat-absorbing unit having at least one cavity body adapted to contact a heat source, and a working fluid received in the cavity body; a condenser to condense the working fluid; and a tubing unit connected fluidly to the condenser and the heat-absorbing unit. The working fluid flows through the tubing unit to circulate from the condenser to the heat-absorbing unit by gravity and from the heat-absorbing unit to the condenser by natural convection. The tubing unit forms a closed circulating loop with the heat-absorbing unit and the condenser.

Claims

1. A heat dissipating system, comprising:

a heat-absorbing unit having at least one cavity body adapted to contact a heat source, and a working fluid received in said cavity body;

a condenser to condense said working fluid; and

a tubing unit connected fluidly to said condenser and said heat-absorbing unit, said working fluid flowing through said tubing unit to circulate from said condenser to said heat-absorbing unit by gravity and from said heat-absorbing unit to said condenser by natural convection, said tubing unit forming a closed circulating loop with said heat-absorbing unit and said condenser.

2. The heat dissipating system of claim 1, wherein said condenser has a top end provided with a vapor-receiving part, an inlet connected fluidly to said vapor-receiving part, a bottom end provided with a liquid-receiving part, an outlet connected fluidly to said liquid-receiving part, and a plurality of channels connected between said vapor-receiving and liquid-receiving parts, said inlet and said outlet of said condenser being disposed at a level higher than that of said cavity body, said working fluid flowing from said cavity body to said inlet of said condenser when vaporized and from said outlet of said condenser to said cavity body after being condensed.

3. The heat dissipating system of claim 2, wherein said condenser includes a thermoelectric cooler having a cold side in contact with said liquid-receiving part, and a hot side opposite to said cold side.

4. The heat dissipating system of claim 3, further comprising a heat sink disposed adjacent to said condenser and having a contact portion in contact with said hot side, and a plurality of fins.

5. The heat dissipating system of claim 4, further comprising a fan disposed proximate to said condenser and said heat sink.

6. The heat dissipating system of claim 2, wherein said heat-absorbing unit includes a plurality of said cavity bodies, each of said cavity bodies having an inlet and an outlet.

7. The heat dissipating system of claim 6, wherein said tubing unit includes a plurality of tubes, said cavity bodies and said condenser being interconnected in series through said tubes, each of said tubes being connected to said inlet of one of said cavity bodies and said condenser and to said outlet of the other one of said cavity bodies and said condenser.

8. The heat dissipating system of claim 6, wherein said tubing unit includes a first manifold, a plurality of spaced-apart first tubes each connected between said first manifold and said inlet of a respective one of said cavity bodies, a second manifold, a plurality of spaced-apart second tubes each connected between said second manifold and said outlet of the respective one of said cavity bodies, a third tube connected between said liquid-receiving part and said first manifold, and a fourth tube connected between said vapor-receiving part and said second manifold.

9. A computer module comprising:

a housing;

at least one chip disposed in said housing;

a heat-absorbing unit having at least one cavity body contacting said chip, and a working fluid received in said cavity body;

a condenser disposed in said housing to condense said working fluid; and

a tubing unit connected fluidly to said condenser and said heat-absorbing unit, said working fluid flowing through said tubing unit to circulate from said condenser to said heat-absorbing unit by gravity and from said heat-absorbing unit to said condenser by natural convection, said tubing unit forming a closed circulating loop with said heat-absorbing unit and said condenser.

10. The computer module of claim 9, wherein said condenser has a top end provided with a vapor-receiving part, an inlet connected fluidly to said vapor-receiving part, a bottom end provided with a liquid-receiving part, an outlet connected fluidly to said liquid-receiving part, and a plurality of channels connected between said vapor-receiving and liquid-receiving parts, said inlet and said outlet of said condenser being disposed at a level higher than that of said cavity body, said working fluid flowing from said cavity body to said inlet of said condenser when vaporized and from said outlet of said condenser to said cavity body after being condensed.

11. The computer module of claim 10, wherein said condenser includes a thermoelectric cooler having a cold side in contact with said liquid-receiving part, and a hot side opposite to said cold side.

12. The computer module of claim 11, further comprising a heat sink disposed adjacent to said condenser and having a contact portion in contact with said hot side, and a plurality of fins.

13. The computer module of claim 12, further comprising a fan disposed proximate to said condenser and said heat sink.

14. A method for dissipating heat from a heat source, comprising:

(a) contacting the heat source with a heat-absorbing cavity body to cause a working fluid contained in the cavity body to vaporize;

(b) allowing the vaporized working fluid to flow upward and enter a condenser by natural convection;

(c) condensing the vaporized working fluid in the condenser;

(d) cooling the condensed working fluid using a thermoelectric cooler and a heat sink; and

(e) allowing the condensed working fluid to flow downward and back into the cavity body by gravity.