LOOP HEAT PIPE WITH FLEXIBLE ARTERY MESH

• US 20080078530A1
• Filed: 10/02/2006
• Published: 04/03/2008
• Est. Priority Date: 10/02/2006
• Status: Abandoned Application

• Current Assignee: Foxconn Technology Co., Ltd.
• Original Assignee: Foxconn Technology Co., Ltd.
• Inventors: CHANG, CHANG-SHEN, PEI, HSIEN-SHENG, WANG, CHAO-HAO, LIU, JUEI-KHAI
• Application Number:
  US11/309,808
• Publication Number:
  US 20080078530A1
• Time in Patent Office: Days
• US Class Current: 165/104.26
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A loop heat pipe (10) includes an evaporator (11) thermally connected with a heat generating electronic component and including a wick structure (112) disposed therein, a condenser (12) thermally connected with a heat dissipating component, a vapor line (13) and a liquid line (14) connecting the evaporator with the condenser to form a closed loop, a predetermined quantity of bi-phase working medium contained in the closed loop, and an artery mesh (15) located within the liquid line.

Claims

1. A loop heat pipe comprising:

an evaporator configured for thermally connecting with a heat generating electronic component and comprising a wick structure disposed therein;

a condenser configured for thermally connecting with a heat dissipating component;

a vapor line and a liquid line connecting the evaporator with the condenser to form a closed loop;

a predetermined quantity of bi-phase working medium filled in the closed loop; and

an artery mesh positioned within the liquid line.

2. The loop heat pipe of claim 1, wherein the artery mesh has a linear contact with an inner wall of the liquid line.

3. The loop heat pipe of claim 1, wherein a diameter of a cross section of the artery mesh is smaller than that of the liquid line.

4. The loop heat pipe of claim 1, wherein the artery mesh is a flexible hollow tube woven from a plurality of metal wires.

5. The loop heat pipe of claim 4, wherein the material of the metal wires is selected from a group consisting of copper wires and stainless steel wires.

6. The loop heat pipe of claim 1, wherein the artery mesh is formed by weaving a plurality of fiber together.

7. The loop heat pipe of claim 1, wherein the wick structure is selected from the group consisting of grooves, sintered powder, fiber and screen mesh.

8. The loop heat pipe of claim 1, wherein the wick structure is tubular shaped in profile and disposed in an inner wall of the evaporator.

9. The loop heat pipe of claim 1, wherein the wick structure has a closed end contacting with the liquid line and an open end communicating with the vapor line, a vapor channel being defined in a middle portion of the open end.

10. A loop heat pipe comprising:

an evaporator configured for thermally connecting with a heat generating electronic component and comprising a wick structure disposed therein;

a condenser configured for thermally connecting with a heat dissipating component;

a vapor line connecting an open end of the wick structure with the condenser;

a liquid line connecting a closed end of the wick structure with the condenser;

a vapor channel defined in a middle portion of the open end of the wick structure and communicating with the vapor line;

an artery mesh positioned within the liquid line; and

a predetermined quantity of bi-phase working medium contained in the loop heat pipe.

11. The loop heat pipe of claim 10, wherein the artery mesh is a hollow tube in contact with an inner wall of the liquid line.

12. The loop heat pipe of claim 10, wherein a diameter of a cross section of the artery mesh is smaller than that of the liquid line.

13. The loop heat pipe of claim 10, wherein the artery mesh is woven from a plurality of metal wires selected from a group consisting of copper and stainless steel wires.

14. The loop heat pipe of claim 10, wherein the artery mesh is tightly attached to inner walls of the liquid line.

15. The loop heat pipe of claim 10, wherein the wick structure has a column shaped outer wall contacting with an inner wall of the evaporator.

16. The loop heat pipe of claim 10, wherein a diameter of the vapor channel is larger than a diameter of an inner wall of the vapor line.