Illuminated devices utilizing transparent light active sheet material with integrated light emitting diode (LED), and methods and kit therefor
First Claim
1. A transparent lighting system for a conveyance, comprising:
- a transparent light active sheet material; and
an adhesive disposed on the transparent light active sheet material,wherein the transparent light active sheet material comprises top and bottom electrically conductive transparent substrates, a pattern of light emitting diode (LED) chips sandwiched between the electrically conductive transparent substrates, and a non-conductive transparent adhesive material disposed between the top and bottom electrically conductive transparent substrates and the LED chips,wherein the LED chips are preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side,wherein either of the anode and the cathode side is in electrical communication with one of the electrically conductive transparent substrates and the other of the anode and the cathode side is in electrical communication with the other of the electrically conductive transparent substrates.
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Accused Products
Abstract
A transparent lighting system for a conveyance includes a transparent light active sheet material and an adhesive disposed on the transparent light active sheet material. The transparent light active sheet material includes top and bottom electrically conductive transparent substrates, a pattern of light emitting diode (LED) chips sandwiched between the electrically conductive transparent substrates, and a non-conductive transparent adhesive material disposed between the top and bottom electrically conductive transparent substrates and the LED chips. The LED chips are preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side. For the LED chips, either the anode or the cathode side is in electrical communication with one of the electrically conductive transparent substrates, and the other of the anode and the cathode side is in electrical communication with the other of the electrically conductive transparent substrates.
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Citations
13 Claims
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1. A transparent lighting system for a conveyance, comprising:
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a transparent light active sheet material; and an adhesive disposed on the transparent light active sheet material, wherein the transparent light active sheet material comprises top and bottom electrically conductive transparent substrates, a pattern of light emitting diode (LED) chips sandwiched between the electrically conductive transparent substrates, and a non-conductive transparent adhesive material disposed between the top and bottom electrically conductive transparent substrates and the LED chips, wherein the LED chips are preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side, wherein either of the anode and the cathode side is in electrical communication with one of the electrically conductive transparent substrates and the other of the anode and the cathode side is in electrical communication with the other of the electrically conductive transparent substrates. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for using a transparent lighting sheet on a conveyance, comprising:
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providing a transparent light active sheet material; disposing an adhesive sheet on the transparent light active sheet material, wherein the adhesive sheet has a size sufficient to attach the transparent light active sheet material to the conveyance; and attaching, to the conveyance, the transparent light active sheet material with the adhesive sheet disposed thereon, wherein the light active sheet material comprises top and bottom electrically conductive transparent substrates, a pattern of light emitting diode (LED) chips sandwiched between the electrically conductive transparent substrates, and a non-conductive transparent adhesive material disposed between the top and bottom electrically conductive transparent substrates and the LED chips, wherein the LED chips are preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side, wherein either of the anode and the cathode side is in electrical communication with one of the electrically conductive transparent substrates and the other of the anode and the cathode side is in electrical communication with the other of the electrically conductive transparent substrates. - View Dependent Claims (8, 9, 10)
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11. A lighting system kit for attaching a transparent light sheet to a conveyance, comprising:
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a transparent light active sheet material; an adhesive sheet for attaching the transparent light active sheet material to the conveyance, wherein the adhesive sheet has a size sufficient to attach the transparent light active sheet material to the conveyance; and instructions for shaping the transparent light active sheet material and attaching the transparent light active sheet material to the conveyance, wherein the light active sheet material comprises top and bottom electrically conductive transparent substrates, a pattern of light emitting diode (LED) chips sandwiched between the electrically conductive transparent substrates, and a non-conductive transparent adhesive material disposed between the top and bottom electrically conductive transparent substrates and the LED chips, wherein the LED chips are preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side, wherein either of the anode and the cathode side is in electrical communication with one of the electrically conductive transparent substrates and the other of the anode and the cathode side is in electrical communication with the other of the electrically conductive transparent substrates. - View Dependent Claims (12, 13)
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Specification