SEMICONDUCTOR DEVICE WITH BULB-TYPE RECESSED CHANNEL AND METHOD FOR FABRICATING THE SAME
First Claim
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1. A method for fabricating a semiconductor device, the method comprising:
- providing a substrate having a bulb-type recessed region;
forming a gate insulating layer over the bulb-type recessed region and the substrate; and
forming a gate conductive layer over the gate insulating layer and filling the bulb-type recessed region, wherein the gate conductive layer includes two or more conductive layers and a discontinuous interface between the conductive layers.
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Abstract
A method for fabricating a semiconductor device includes providing a substrate having a bulb-type recessed region, forming a gate insulating layer over the bulb-type recessed region and the substrate, and forming a gate conductive layer over the gate insulating layer. The gate conductive layer fills the bulb-type recessed region. The gate conductive layer includes two or more conductive layers and a discontinuous interface between the conductive layers.
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Citations
25 Claims
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1. A method for fabricating a semiconductor device, the method comprising:
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providing a substrate having a bulb-type recessed region; forming a gate insulating layer over the bulb-type recessed region and the substrate; and forming a gate conductive layer over the gate insulating layer and filling the bulb-type recessed region, wherein the gate conductive layer includes two or more conductive layers and a discontinuous interface between the conductive layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor device comprising:
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a substrate; a bulb-type recessed region formed in the substrate; a gate insulating layer formed over the bulb-type recessed region and the substrate; and a gate conductive layer formed over the gate insulating layer and filling in the bulb-type recessed region, wherein the gate conductive layer includes two or more conductive layers and a discontinuous interface between the conductive layers. - View Dependent Claims (19, 20, 21, 22, 23)
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24. A method for fabricating a semiconductor device, the method comprising:
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providing a substrate having a bulb-type recessed region; forming a gate insulating layer over the bulb-type recessed region and the substrate; forming a first gate conductive layer having a first thickness over the gate insulating layer; performing a thermal treatment on the first gate conductive layer; and forming a second gate conductive layer having a second thickness over the first gate conductive layer, wherein the second gate conductive layer fills the bulb-type recessed region, wherein a discontinuous interface is formed between the first gate conductive layer and the second gate conductive layer.
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25. A method for fabricating a semiconductor device, the method comprising:
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providing a substrate having a bulb-type recessed region; forming a gate insulating layer over the bulb-type recessed region and the substrate; providing a source gas on the gate insulating layer to form a first gate conductive layer having a first thickness; temporarily stopping providing the source gas; and providing the source gas again to form a second gate conductive layer having a second thickness over the first gate conductive layer, wherein the second gate conductive layer fills the bulb-type recessed region, wherein a discontinuous interface is formed between the first gate conductive layer and the second gate conductive layer.
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Specification