METHOD OF MAKING A LIGHT EMITTING DEVICE HAVING A MOLDED ENCAPSULANT
First Claim
1. A method of making a light emitting device, the method comprising:
- (a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;
(b) providing a mold having a cavity filled with a second polymerizable composition;
(c) contacting the first and second polymerizable compositions;
(d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and
(e) optionally separating the mold from the second polymerized composition.
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Abstract
Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.
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Citations
55 Claims
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1. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;
(b) providing a mold having a cavity filled with a second polymerizable composition;
(c) contacting the first and second polymerizable compositions;
(d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and
(e) optionally separating the mold from the second polymerized composition. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;
(b) providing a transparent mold having a cavity filled with a second polymerizable composition;
(c) polymerizing the first polymerizable composition to form a first partially polymerized composition, wherein polymerizing the first polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less;
(d) inverting the LED package to contact the first partially polymerized composition and the second polymerizable composition; and
(e) polymerizing the second polymerizable composition to form a second partially polymerized composition, wherein polymerizing the second polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less. - View Dependent Claims (28, 29, 30, 31)
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32. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;
(b) providing a transparent mold having a cavity filled with a second polymerizable composition;
(c) polymerizing the second polymerizable composition to form a second partially polymerized composition, wherein polymerizing the second polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less; and
(d) inverting the mold to contact the first polymerizable composition and the second partially polymerized composition;
(e) polymerizing the first polymerizable composition to form a first partially polymerized composition, wherein polymerizing the first polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less. - View Dependent Claims (33, 34, 35, 36)
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37. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;
(b) providing a mold having a cavity filled with a second polymerizable composition;
(c) polymerizing the first and second polymerizable compositions to form first and second partially polymerized compositions, respectively, wherein polymerizing comprises applying actinic radiation having a wavelength of 700 nm or less; and
(d) contacting the first and second partially polymerized compositions. - View Dependent Claims (38, 39, 40)
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41. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;
(b) providing a mold having a cavity filled with a second polymerizable composition;
(c) polymerizing the first polymerizable composition to form a first partially polymerized composition, wherein polymerizing the first polymerizable composition comprises heating;
(d) inverting the LED package to contact the first partially polymerized composition and the second polymerizable composition; and
(e) polymerizing the second polymerizable composition to form a second partially polymerized composition, wherein polymerizing the second polymerizable composition comprises heating. - View Dependent Claims (42, 43)
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44. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;
(b) providing a mold having a cavity filled with a second polymerizable composition;
(c) polymerizing the second polymerizable composition to form a second partially polymerized composition, wherein polymerizing the second polymerizable composition comprises heating;
(d) inverting the mold to contact the first polymerizable composition and the second partially polymerized composition; and
(e) polymerizing the first polymerizable composition to form a first partially polymerized composition, wherein polymerizing the first polymerizable composition comprises heating. - View Dependent Claims (45, 46)
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47. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;
(b) providing a mold having a cavity filled with a second polymerizable composition;
(c) polymerizing the first and second polymerizable compositions to form first and second partially polymerized compositions, respectively, wherein polymerizing comprises heating; and
(d) contacting the first and second partially polymerized compositions. - View Dependent Claims (48, 49)
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50. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated, wherein the first polymerizable composition is thixotropic;
(b) providing a transparent mold having a cavity filled with a second polymerizable composition, wherein the second polymerizable composition is thixotropic;
(c) contacting the first and second polymerizable compositions; and
(d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together, and polymerizing comprises applying actinic radiation having a wavelength of 700 nm or less.
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52. The method of claim 51, wherein providing an LED package comprising an LED die disposed in a reflecting cup comprises providing a plurality of LED packages disposed on a lead frame, each LED package comprising an LED die disposed in a reflecting cup.
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53. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated, wherein the first polymerizable composition is thixotropic;
(b) providing a mold having a cavity filled with a second polymerizable composition, wherein the second polymerizable composition is thixotropic;
(c) contacting the first and second polymerizable compositions; and
(d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together, and polymerizing comprises heating. - View Dependent Claims (54)
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55. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a nonpolymerizable composition such that the LED die is encapsulated;
(b) providing a mold having a cavity filled with a second polymerizable composition;
(c) contacting the nonpolymerizable composition and the second polymerizable composition;
(d) polymerizing the second polymerizable composition to form a second polymerized composition, wherein the nonpolymerizable and second polymerized compositions are bonded together; and
(e) optionally separating the mold from the second polymerized composition.
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Specification