Lighting systems using light active sheet material with integrated leadframe, and methods for manufacturing the same
First Claim
1. A lighting system, comprising:
- a leadframe; and
a light active sheet material laminated on the leadframe and electrically connected to the leadframe,wherein the light active sheet material comprises a transparent electrically conductive top substrate, a pattern of at least one light emitting diode (LED) chip sandwiched between the leadframe and the top substrate, and a non-conductive transparent adhesive material disposed between the leadframe, the at least one LED chip, and the top substrate,wherein the at least one LED chip is preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side,wherein either of the anode and the cathode side is in electrical communication with the top substrate and the other of the anode and the cathode side is in electrical communication with the leadframe.
1 Assignment
0 Petitions
Accused Products
Abstract
A lighting system includes a leadframe, and a light active sheet material laminated on the leadframe and electrically connected to the leadframe. The light active sheet material includes a transparent electrically conductive top substrate, a pattern of one or more light emitting diode (LED) chip(s) sandwiched between the leadframe and the top substrate, and a non-conductive transparent adhesive material disposed between the leadframe, the LED chip(s), and the top substrate. The LED chip(s) is (are) preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side. Either of the anode and the cathode side is in electrical communication with the top substrate and the other of the anode and the cathode side is in electrical communication with the leadframe.
82 Citations
30 Claims
-
1. A lighting system, comprising:
-
a leadframe; and a light active sheet material laminated on the leadframe and electrically connected to the leadframe, wherein the light active sheet material comprises a transparent electrically conductive top substrate, a pattern of at least one light emitting diode (LED) chip sandwiched between the leadframe and the top substrate, and a non-conductive transparent adhesive material disposed between the leadframe, the at least one LED chip, and the top substrate, wherein the at least one LED chip is preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side, wherein either of the anode and the cathode side is in electrical communication with the top substrate and the other of the anode and the cathode side is in electrical communication with the leadframe. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A method of manufacturing a lighting system, comprising:
-
providing a leadframe, the leadframe comprising leads and light emitting diode (LED) chip placement portions; placing a pattern of LED chips on an LED chip placement portion of the leadframe; disposing an adhesive on the leadframe and the LED chips, the adhesive being formed of a non-conductive transparent adhesive material; and after disposing the adhesive, laminating a transparent electrically conductive top substrate on the adhesive and the LED chips, wherein the LED chips are preformed before being patterned as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side, wherein either of the anode and the cathode side is in electrical communication with the top substrate and the other of the anode and the cathode side is in electrical communication with the leadframe. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
-
-
26. A method of providing a conveyance with a lighting system, comprising:
-
providing a lighting system, wherein the lighting system includes a leadframe, and a light active sheet material laminated on the leadframe and electrically connected to the leadframe, wherein the light active sheet material comprises a transparent electrically conductive top substrate, and a pattern of light emitting diode (LED) chips sandwiched between the leadframe and the top substrate, wherein the LED chips are preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side, wherein either of the anode and the cathode side is in electrical communication with the top substrate and the other of the anode and the cathode side is in electrical communication with the leadframe, wherein a non-conductive transparent adhesive material disposed between the leadframe, the LED chips, and the top substrate, mounting the lighting system on the conveyance; and electrically connecting the lighting system to an electrical wiring harness of the conveyance. - View Dependent Claims (27)
-
-
28. A method of manufacturing a lighting device, comprising:
-
providing a lighting system, wherein the lighting system includes a leadframe, and a light active sheet material laminated on the leadframe and electrically connected to the leadframe, wherein the light active sheet material comprises a transparent electrically conductive top substrate, and a pattern of light emitting diode (LED) chips sandwiched between the leadframe and the top substrate, wherein the LED chips are preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side, wherein either of the anode and the cathode side is in electrical communication with the top substrate and the other of the anode and the cathode side is in electrical communication with the leadframe, and wherein a non-conductive transparent adhesive material is disposed between the leadframe, the LED chips, and the top substrate; providing a mold having a predetermined dimension; forming the lighting system to the predetermined dimension; placing the formed lighting system in the mold; filling the mold with a polymer; and curing the polymer in the mold, to form a lighting device. - View Dependent Claims (29, 30)
-
Specification