Substrate processing apparatus and attaching/detaching method of reaction vessel

• US 20080083109A1
• Filed: 09/19/2007
• Published: 04/10/2008
• Est. Priority Date: 09/25/2006
• Status: Active Grant

• Current Assignee: Kokusai Electric Corp.
• Original Assignee: Hitachi Kokusai Electric Incorporated (Hitachi, Ltd.)
• Inventors: SHIBATA, Koji, TATTA, Masahiro
• Granted Patent: US 8,172,947 B2
• Time in Patent Office: Days
• US Class Current: 29/428
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 21/67757 vertical transfer of a batch of workpieces
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49799 Providing transitory integral holding or handling portion
• CPC Class Codes: Y10T 29/4981 Utilizing transitory attached element or associated separate material
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

To provide a substrate processing apparatus, comprising: a reaction vessel having a processing chamber inside that processes a substrate; a heating device that heats said substrate from an outer peripheral side of the reaction vessel; a lid member that closes the processing chamber; an attachment/detachment jig placed on the lid member for attaching/detaching the reaction vessel from an inside of the heating device; and a support section provided in an upper side of a lower end of the reaction vessel on an inside wall of the reaction vessel, and abutted on an upper surface of the attachment/detachment jig for attaching/detaching the reaction vessel from the inside of the heating device.

Claims

1. A substrate processing apparatus, comprising:

a reaction vessel having a processing chamber inside that processes a substrate;

a heating device that heats said substrate from an outer peripheral side of the reaction vessel;

a lid member that closes said processing chamber;

an attachment/detachment jig placed on said lid member for attaching/detaching said reaction vessel from an inside of said heating device; and

a support section provided in an upper side of a lower end of the reaction vessel on an inside wall of said reaction vessel, and abutted on an upper surface of said attachment/detachment jig for attaching/detaching said reaction vessel from the inside of said heating device.

2. The substrate processing apparatus according to claim 1, wherein weight of said reaction vessel is added to said support section when said reaction vessel is abutted on said attachment/detachment jig for attaching/detaching said reaction vessel from the inside of said heating device.

3. The substrate processing apparatus according to claim 1, wherein said attachment/detachment jig is constituted to have a vertical thickness of a part abutted on at least said support section made larger than a vertical length between a lower end of said reaction vessel and a lower end of said support section.

4. The substrate processing apparatus according to claim 1, wherein when said substrates is processed in said reaction vessel, an inner tube is placed on an upper surface of said support section, the inner tube having a cylindrical shape with upper and lower ends opened and formed of a material having heat resistance and corrosion resistance.

5. The substrate processing apparatus according to claim 1, wherein said reaction vessel is constituted of a reaction tube and a holder that holds a lower end of this reaction tube.

6. The substrate processing apparatus according to claim 1, wherein a disc part is formed in said attachment/detachment jig, having an outer diameter smaller than an inner diameter of said reaction vessel and larger than an inner diameter drawn by a tip part of said support section.

7. The substrate processing apparatus according to claim 6, wherein said disc part is formed of aluminum alloy.

8. The substrate processing apparatus according to claim 1, wherein the lower end of said reaction vessel is not added with a weight of said reaction vessel when said reaction vessel is attached/detached from the inside of said heating device.

9. The substrate processing apparatus according to claim 5, wherein the lower end of said holder is set in a non-contact state with said attachment/detachment jig when said reaction tube is attached/detached from the inside of said heating device.

10. The substrate processing apparatus according to claim 1, wherein a preliminary chamber continuously provided on a lower side of said processing chamber and a maintenance area adjacent to one side surface of said preliminary chamber are provided so as to be communicated with each other, and an opening part is provided so as to open in one side surface to enable the attachment/detachment jig to be moved horizontally between said preliminary chamber and said maintenance area.

11. The substrate processing apparatus according to claim 10, wherein said opening part is opened so that the attachment/detachment jig can not be moved horizontally between said preliminary chamber and said maintenance area, with said reaction vessel supported by said attachment/detachment jig on the lower end of said reaction vessel.

13. An attaching/detaching method of the reaction vessel using the substrate processing apparatus according to claim 1, comprising the steps of:

placing said attachment/detachment jig on said lid member; and

making said support section and said attachment/detachment jig abut on each other and attaching said reaction vessel in the inside of said heating device.

15. A manufacturing method of a semiconductor device that processes a substrate by using the substrate processing device according to claim 1, comprising the steps of:

making said support section and said attachment/detachment jig abut on each other and attaching said reaction vessel in the inside of said heating device;

detaching said attachment/detachment jig from said lid member; and

closing the processing chamber provided inside of said attached reaction vessel with a lid member and heating and processing the substrate from the outer peripheral side of said reaction vessel.

12. A substrate processing apparatus, comprising:

a reaction vessel having inside a processing chamber that processes a substrate;

a heating device that heats said substrate from an outer peripheral side of this reaction vessel;

a lid member that closes said processing chamber;

an attachment/detachment jig placed on said lid member when said reaction vessel is attached in the inside of said heating device; and

a support section provided in an upper side of a lower end of said reaction vessel on an inside wall of said reaction vessel, and abutted on said attachment/detachment jig for attaching said reaction vessel in the inside of said heating device.

14. An attaching/detaching method of the reaction vessel using the substrate processing apparatus according to claim 12, comprising the steps of:

placing said attachment/detachment jig on said lid member; and

making said support section and said attachment/detachment jig abut on each other and attaching said reaction vessel in the inside of said heating device.

16. A manufacturing method of a semiconductor device that processes the substrate by using the substrate processing apparatus according to claim 12, comprising the steps of:

making said support section and said attachment/detachment jig abut on each other and attaching said reaction vessel in the inside of said heating device;

detaching said attachment/detachment jig form said lid member; and

closing the processing chamber provided in the inside of said attached reaction vessel by the lid member and heating and processing the substrate by the heating device from the outer peripheral side of said reaction vessel.

17. A manufacturing method of a semiconductor device, comprising the steps of:

making a support section provided in an upper side of a lower end of the reaction vessel on an inner wall of a reaction vessel and an attachment/detachment jig placed on the lid member that closes said reaction vessel abut on each other and attaching said reaction vessel in the inside of said heating device;

detaching said attachment/detachment jig from said lid member; and

closing a processing chamber provided in the inside of said attached reaction vessel by a lid member and heating and processing a substrate by the heating device from an outer peripheral side of said reaction vessel.