Reverse side film laser circuit etching

• US 20080083706A1
• Filed: 08/27/2007
• Published: 04/10/2008
• Est. Priority Date: 10/05/2006
• Status: Abandoned Application

• Current Assignee: Mu-Gahat Enterprises LLC
• Original Assignee: Mu-Gahat Enterprises LLC
• Inventors: Kirmeier, Josef
• Application Number:
  US11/895,724
• Publication Number:
  US 20080083706A1
• Time in Patent Office: Days
• US Class Current: 219/72
• CPC Class Codes: B23K 2101/34 Coated articles , e.g. plated or painted; Surface treated articles
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 2103/172 wherein at least one of the layers is non-metallic
• CPC Class Codes: B23K 26/009 using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece using a mask on the workpiece B23K26/066
• CPC Class Codes: B23K 26/082 Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• CPC Class Codes: B23K 26/0846 for moving elongated workpieces longitudinally, e.g. wire or strip material
• CPC Class Codes: B23K 26/355 Texturing
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: B23K 26/702 Auxiliary equipment
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2203/082 Suction, e.g. for holding solder balls or components
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/027 the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Abstract

In one embodiment the present invention includes a direct-write laser lithography system. The system includes a reel-to-reel feed system that presents the clear film-side of a single-sided metal-clad tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by a moving mirror, and is intense enough to ablate the metal but not so strong as to destroy the tape substrate. In another instance, two specialized lasers are used, one tuned to ablate large field areas, and the other tuned to scribe fine features and lines. The ablated metal blows off in a downward direction and is collected for recycling.

Claims

1. A method of etching metal structures on a substrate, said method comprising the steps of:

providing a coated sheet, said coated sheet having a first side that comprises a dielectric substrate and a second side that comprises a metal; and

controlling a laser to generate a laser beam toward said first side of said coated sheet such that said laser beam passes through said first side and ablates portions of said second side.

2. The method of claim 1, further comprising:

configuring said coated sheet into a tape;

mounting said tape into a reel-to-reel transport system; and

controlling said reel-to-reel transport system to move said tape relative to said laser.

3. The method of claim 1, further comprising:

orienting said coated sheet such that said second side faces downward and gravity helps to move ablated material away from said coated sheet for recycling.

4. The method of claim 1, wherein said laser comprises a first laser, further comprising:

controlling a second laser to generate a second laser beam toward said first side of said coated sheet such that said second laser beam passes through said first side and ablates additional portions of said second side, wherein one of said first laser and said second laser is tuned to ablate a large area, wherein another of said first laser and said second laser is tuned to ablate a small area, and wherein operation of said first laser and said second laser is coordinated to provide a single result.

5. The method of claim 1, further comprising:

moving a mirror in a path of said laser beam to provide for transverse movement of said laser beam across said coated sheet.

6. The method of claim 1, further comprising:

heating said coated sheet, in order to reduce an amount of laser power needed to ablate said metal.

7. The method of claim 1, further comprising:

mechanically stressing said coated sheet, in order to reduce an amount of laser power needed to ablate said metal.

8. The method of claim 1, further comprising:

cooling said coated sheet, in order to reduce an amount of laser power needed to ablate said metal.

9. The method of claim 1, wherein said step of controlling said laser further comprises:

controlling said laser to generate said laser beam selectively in a thermal isolation mode and in a structural mode, wherein said thermal isolation mode operates to perform ablation to thermally isolate a portion of said second side, and wherein said structural mode operates to perform ablation to form structures on said portion having been thermally isolated.

10. The method of claim 1, further comprising:

orienting said coated sheet such that said second side faces downward, and vacuum directed airflow helps to move said portions of said second side away from said coated sheet for recycling after having been ablated.

11. An apparatus including a flexible circuit etching system, said flexible circuit etching system comprising:

a reel-to-reel tape system that linearly presents a coated tape, wherein said coated tape has a first side that comprises a dielectric substrate and a second side that comprises a metal;

a laser that generates a laser beam having a power sufficient to ablate said metal from said second side of said coated tape; and

a mirror that controllably moves to direct said laser beam toward said first side of said coated tape such that said laser beam passes through said first side and ablates portions of said second side.

12. The apparatus of claim 11, further comprising:

a collection and recycling system positioned to collect ablated portions of said metal having been ablated by said laser beam.

13. The apparatus of claim 11, further comprising:

a control system, coupled to said reel-to-reel tape system, to said laser, and to said mirror, that controls said reel-to-reel tape system, said laser, and said mirror,

wherein said control system controls said laser to generate said laser beam selectively in a thermal isolation mode and in a structural mode, wherein said thermal isolation mode operates to perform ablation to thermally isolate a portion of said second side, and wherein said structural mode operates to perform ablation to form structures on said portion having been thermally isolated, and

wherein said control system controls said reel-to-reel tape system and said mirror to coordinate appropriate placement of said coated tape in accordance with control of said laser.

14. The apparatus of claim 11, further comprising:

a plurality of galvo head devices that include a plurality of mirrors that controllably each move to direct a plurality of laser beams toward said first side of said coated tape such that said plurality of laser beams each pass through said first side and ablate portions of said second side.

15. An apparatus including a dual laser flexible circuit etching system, said dual laser flexible circuit etching system comprising:

a reel-to-reel tape system that linearly presents a coated tape, wherein said coated tape has a first side that comprises a dielectric substrate and a second side that comprises a metal;

a first laser that generates a first laser beam having a power sufficient to ablate a large area of said metal from said second side of said coated tape;

a first mirror that controllably moves to direct said first laser beam toward said first side of said coated tape such that said first laser beam passes through said first side and ablates large portions of said second side;

a second laser that generates a second laser beam having a power sufficient to ablate a small area of said metal from said second side of said coated tape; and

a second mirror that controllably moves to direct said second laser beam toward said first side of said coated tape such that said second laser beam passes through said first side and ablates small portions of said second side.

16. The apparatus of claim 15, further comprising:

a control system, coupled to said reel-to-reel tape system, to said first laser, to said first mirror, to said second laser, and to said second mirror, that controls said reel-to-reel tape system, said first laser, said first mirror, said second laser, and said second mirror,

wherein said control system controls said first laser and said second laser to generate said first laser beam and said second laser beam selectively in a thermal isolation mode and in a structural mode, wherein said thermal isolation mode operates to perform ablation to thermally isolate a portion of said second side, and wherein said structural mode operates to perform ablation to form structures on said portion having been thermally isolated, and

wherein said control system controls said reel-to-reel tape system, said first mirror and said second mirror to coordinate appropriate placement of said coated tape in accordance with control of said first laser and said second laser.

17. An apparatus including a laser ablation machine for patterning metal cladding on a dielectric substrate, said laser ablation machine comprising:

a laser; and

a patterning control system that positions said laser in relation to a coated sheet, wherein said coated sheet has a first side that comprises a dielectric substrate and a second side that comprises a metal,

wherein said laser generates a laser beam having a power sufficient to ablate said metal from said second side of said coated tape, and wherein said laser beam passes through said first side and ablates portions of said second side.

18. The apparatus of claim 17, further comprising:

a control system, coupled to said laser and to said patterning control system, that controls said laser and said patterning control system,

wherein said control system controls said laser to generate said laser beam selectively in a thermal isolation mode and in a structural mode, wherein said thermal isolation mode operates to perform ablation to thermally isolate a portion of said second side, and wherein said structural mode operates to perform ablation to form structures on said portion having been thermally isolated, and

wherein said control system controls said patterning control system to coordinate appropriate placement of said laser in relation to said coated sheet in accordance with control of said laser.

19. An apparatus including an electrical circuit, said electrical circuit produced by a method comprising the steps of:

providing a coated sheet, said coated sheet having a first side that comprises a dielectric substrate and a second side that comprises a metal; and

controlling a laser to generate a laser beam toward said first side of said coated sheet such that said laser beam passes through said first side and ablates portions of said second side to form said electrical circuit on said coated sheet.

20. The apparatus of claim 19, wherein said electrical circuit comprises an antenna for a radio frequency identification (RFID) tag.

21. The apparatus of claim 19, wherein said electrical circuit comprises a thermal circuit.