ACTIVE PIXEL SENSOR HAVING TWO WAFERS
First Claim
Patent Images
1. An active pixel sensor comprising:
- (a) a sensor wafer comprising;
a first array of pixel regions each pixel region including;
a photodetector for collecting charge in response to incident light;
a transfer gate for transferring charge from the photodetector; and
a charge-to-voltage conversion mechanism for receiving the charge from the photodetector via the transfer gate;
(b) a support circuit wafer connected to the sensor wafer and including;
a second array of pixel regions having support circuitry for each pixel region in the first array, wherein each pixel region in the second array is associated with one or more pixel regions in the first array; and
(c) an inter-wafer connector between each charge-to-voltage conversion mechanism on the sensor wafer and an electrical node in a respective pixel region on the support circuit wafer for transferring charge from the charge-to-voltage conversion mechanism to the support circuit wafer.
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Abstract
A vertically-integrated active pixel sensor includes a sensor wafer connected to a support circuit wafer. Inter-wafer connectors or connector wires transfer signals between the sensor wafer and the support circuit wafer. The active pixel sensor can be fabricated by attaching the sensor wafer to a handle wafer using a removable interface layer. Once the sensor wafer is attached to the handle wafer, the sensor wafer is backside thinned to a given thickness. The support circuit wafer is then attached to the sensor wafer and the handle wafer separated from the sensor wafer.
160 Citations
19 Claims
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1. An active pixel sensor comprising:
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(a) a sensor wafer comprising; a first array of pixel regions each pixel region including; a photodetector for collecting charge in response to incident light; a transfer gate for transferring charge from the photodetector; and a charge-to-voltage conversion mechanism for receiving the charge from the photodetector via the transfer gate; (b) a support circuit wafer connected to the sensor wafer and including; a second array of pixel regions having support circuitry for each pixel region in the first array, wherein each pixel region in the second array is associated with one or more pixel regions in the first array; and (c) an inter-wafer connector between each charge-to-voltage conversion mechanism on the sensor wafer and an electrical node in a respective pixel region on the support circuit wafer for transferring charge from the charge-to-voltage conversion mechanism to the support circuit wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An active pixel sensor comprising:
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(a) a sensor wafer including; an array of active pixel regions, each active pixel region having; a photodetector for collecting charge in response to light; readout circuitry for reading charge from the photodetector; and a first plurality of interconnects connected to the readout circuitry; (b) a support circuit wafer connected to the sensor wafer, wherein the support circuit wafer includes; support circuitry for the array of active pixel regions; and a second plurality of interconnects; and (c) a plurality of inter-wafer connector wires for transferring one or more signals between the sensor wafer and the support circuit wafer, wherein each inter-wafer connector wire is connected between a first interconnect on the sensor wafer and a corresponding interconnect on the support circuit wafer. - View Dependent Claims (10, 11, 12)
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13. A method for fabricating an active pixel sensor comprising a sensor wafer and a support circuit wafer, the method including:
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attaching the sensor wafer to a handle wafer using a removable interface layer; backside thinning the sensor wafer to a given thickness; attaching the support circuit wafer to the sensor wafer; and separating the handle wafer from the sensor wafer. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification