MICRO-ELECTROMECHANICAL SYSTEM PACKAGE

• US 20080083957A1
• Filed: 10/05/2006
• Published: 04/10/2008
• Est. Priority Date: 10/05/2006
• Status: Abandoned Application

• Current Assignee: Merry Electronics Company Limited
• Original Assignee: Merry Electronics Company Limited
• Inventors: Chang, Chih-Wei, Her, Hong-Ching, Gong, Shih-Chin, Wei, Wen-Chieh
• Application Number:
  US11/539,025
• Publication Number:
  US 20080083957A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

A micro-electromechanical system package includes a substrate, a group of components, isolative stuff and a conductive shield. The substrate is made with an upper face and a lower face. The group is mounted on the upper face of the substrate. The isolative stuff seals the group and the upper face of the substrate, thus protecting the group from moisture. The conductive shield covers the isolative stuff, thus protecting the group from electromagnetic interference.

Claims

1. A micro-electromechanical system package comprising:

a substrate comprising an upper surface and a lower surface;

a group of components mounted on the upper surface of the substrate;

isolative stuff for sealing the group and the upper surface of the substrate, thus protecting the group from moisture; and

a conductive shield for covering the isolative stuff, thus protecting the group from electromagnetic interference.

2. The micro-electromechanical system according to claim 1 wherein the group comprises a micro-electromechanical system microphone and an application specific integrated circuit electrically connected to the micro-electromechanical system microphone.

3. The micro-electromechanical system according to claim 2 wherein the micro-electromechanical system microphone comprises a diaphragm and a perforated back plate mounted thereon and defines a lower chamber below the diaphragm and an upper chamber above the diaphragm so that the lower and upper chambers allow the vibration of the membrane.

4. The micro-electromechanical system package according to claim 3 wherein the substrate defines a sound aperture in communication with the lower chamber so that sound travels to the diaphragm through the lower chamber and the sound aperture.

5. The micro-electromechanical system according to claim 3 wherein the micro-electromechanical system microphone comprises a cover mounted on the membrane so that the upper chamber is defined by the cover and the membrane.

6. The micro-electromechanical system package according to claim 5 wherein the cover, the isolative shield and the conductive shield define a sound aperture in communication with the upper chamber so that sound travels to the membrane through the upper chamber and the sound aperture.

7. The micro-electromechanical system package according to claim 1 wherein the conductive shield comprises a rim mounted on the upper surface of the substrate.

8. The micro-electromechanical system package according to claim 7 wherein the rim is electrically connected to an electronic device that incorporates the micro-electromechanical system package.

9. The micro-electromechanical system package according to claim 8 wherein the substrate comprises a plurality of solder pads formed on the lower surface thereof for electrically connecting the substrate to the electronic device.

10. The micro-electromechanical system package according to claim 1 wherein the conductive shield is provided by vacuum sputtering.

11. The micro-electromechanical system package according to claim 1 wherein the isolative stuff is made of a molding compound.