MICRO-ELECTROMECHANICAL SYSTEM PACKAGE

• US 20080083958A1
• Filed: 01/05/2007
• Published: 04/10/2008
• Est. Priority Date: 10/05/2006
• Status: Abandoned Application

• Current Assignee: Merry Electronics Company Limited
• Original Assignee: Merry Electronics Company Limited
• Inventors: Chang, Chih-Wei, Wei, Wen-Chieh, Her, Hong-Ching, Gong, Shih-Chin
• Application Number:
  US11/620,156
• Publication Number:
  US 20080083958A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

A micro-electromechanical system package includes a substrate, a set of components, at least one solder pad, a frame, a peripheral shield and a top shield. The set is provided on the substrate. At least one solder pad is attached to the substrate opposite to the set. A frame is provided on the substrate. A peripheral shield is provided on the substrate around the set. The isolative stuff seals the set. The isolative stuff defines a tunnel. The top shield is provided on the isolative stuff for shielding the set from electromagnetic interference. The top shield includes a column inserted through the tunnel and connected to the solder pad.

Claims

1. A micro-electromechanical system package comprising:

a substrate;

a set of components provided on the substrate;

at least one solder pad attached to the substrate opposite to the set;

a frame provided on the substrate;

a peripheral shield provided on the substrate around the set;

isolative stuff for sealing the set, the isolative stuff defining a tunnel; and

a top shield provided on the isolative stuff for shielding the set from electromagnetic interference, the top shield comprising a column inserted through the tunnel and connected to the solder pad.

2. The micro-electromechanical system according to claim 1 wherein the peripheral shield covers the bottom and a side of the frame.

3. The micro-electromechanical system according to claim 1 wherein the peripheral shield covers the top, the bottom and a side of the frame.

4. The micro-electromechanical system according to claim 1 wherein the set comprises a micro-electromechanical system microphone and an application specific integrated circuit electrically connected to the micro-electromechanical system microphone.

5. The micro-electromechanical system according to claim 4 wherein the micro-electromechanical system microphone defines a lower chamber below the membrane and an upper chamber above the membrane so that the lower and upper chambers allow the vibration of the membrane.

6. The micro-electromechanical system package according to claim 5 wherein the substrate defines a sound aperture in communication with the lower chamber so that sound waves travel to the membrane through the lower chamber and the sound aperture.

7. The micro-electromechanical system according to claim 5 comprising a cover provided on the micro-electromechanical system microphone so that the upper chamber is defined by the cover and the micro-electromechanical system microphone.

8. The micro-electromechanical system package according to claim 7 wherein the cover, the isolative shield and the top shield define a sound aperture in communication with the upper chamber so that sound waves travel to the membrane through the upper chamber and the sound aperture.

9. The micro-electromechanical system package according to claim 1 wherein the peripheral shield is provided by sputtering.

10. The micro-electromechanical system package according to claim 1 wherein the top shield is provided by sputtering.

11. The micro-electromechanical system package according to claim 1 wherein the isolative stuff is made of a molding compound.