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MICRO-ELECTROMECHANICAL SYSTEM PACKAGE

  • US 20080083958A1
  • Filed: 01/05/2007
  • Published: 04/10/2008
  • Est. Priority Date: 10/05/2006
  • Status: Abandoned Application
First Claim
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1. A micro-electromechanical system package comprising:

  • a substrate;

    a set of components provided on the substrate;

    at least one solder pad attached to the substrate opposite to the set;

    a frame provided on the substrate;

    a peripheral shield provided on the substrate around the set;

    isolative stuff for sealing the set, the isolative stuff defining a tunnel; and

    a top shield provided on the isolative stuff for shielding the set from electromagnetic interference, the top shield comprising a column inserted through the tunnel and connected to the solder pad.

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