PACKAGE STRUCTURE AND PACKAGING METHOD OF MEMS MICROPHONE

• US 20080083960A1
• Filed: 06/08/2007
• Published: 04/10/2008
• Est. Priority Date: 08/29/2006
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chu, Chun-Hsun, Chen, Jung-Tai
• Granted Patent: US 7,560,857 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials

Abstract

A package structure of a micro-electromechanical system (MEMS) type microphone is disclosed. The MEMS microphone comprises a substrate, a MEMS chip, an acoustic wave cover, and an encapsulant. The substrate has connection pads. The MEMS chip is electrically coupled to the connection pads. The MEMS chip includes an acoustic wave sensing portion. The acoustic wave cover is fixed on the MEMS chip for covering without contacting the acoustic wave sensing portion and defining an acoustic wave cavity space. The acoustic wave cover has an opening for allowing an acoustic wave to enter or exit out of the acoustic cavity space. The encapsulant encapsulates the substrate, the MEMS chip, and the acoustic wave cover, wherein a surface of the acoustic wave cover is exposed. The exposed surface of the acoustic wave cover is along the same level as the surface of the encapsulant.

Claims

1. A package structure of a micro-electromechanical system (MEMS) type microphone, comprising:

a substrate, having a connection pad;

a MEMS microphone module, electrically coupled to the connection pad of the substrate, comprising an acoustic wave sensing portion;

an acoustic wave cover, fixed on the MEMS microphone module, for covering without contacting the acoustic wave sensing portion to define an acoustic wave cavity space, wherein the acoustic wave cover comprises an opening for the acoustic wave to enter or exit out of the acoustic wave cavity space; and

an encapsulant, encapsulating the substrate, the MEMS microphone module and the acoustic wave cover, wherein a surface of the acoustic wave cover is exposed, and wherein the exposed surface of the acoustic wave cover is along a same plane as a surface of the encapsulant.

2. The package structure of the MEMS microphone as claimed in claim 1, wherein the acoustic wave cover comprises a conductive material.

3. The package structure of the MEMS microphone as claimed in claim 1, wherein the acoustic wave cover comprises a radio-frequency-interference (RFI) shielding material.

4. The package structure of the MEMS microphone as claimed in claim 1, wherein the acoustic wave cover comprises an electromagnetic interference shielding material.

5. The package structure of the MEMS microphone as claimed in claim 1, wherein the substrate comprises a ceramic substrate.

6. The package structure of the MEMS microphone as claimed in claim 1, wherein the substrate comprises a plastic substrate.

7. The package structure of the MEMS microphone as claimed in claim 1, wherein the substrate comprises a flexible substrate.

8. The package structure of the MEMS microphone as claimed in claim 1, wherein the MEMS microphone module comprises a MEMS microphone chip.

9. The package structure of the MEMS microphone as claimed in claim 8, wherein the MEMS microphone module comprises a logic chip, the acoustic wave sensing portion is disposed on the MEMS microphone chip, and the acoustic wave cover is fixed on the MEMS microphone chip.

10. The package structure of the MEMS microphone as claimed in claim 9, wherein the MEMS microphone chip is stacked on the logic chip.

11. The package structure of the MEMS microphone as claimed in claim 1, wherein the MEMS microphone module is a system chip which is formed by integrating a MEMS microphone chip and a logic chip.

12. The package structure of the MEMS microphone as claimed in claim 1, wherein the encapsulant comprises a resin material.

13. A method of packaging the MEMS microphone, comprising:

providing a wafer having a plurality of MEMS microphone chips, wherein each of the MEMS microphone chips comprises an acoustic wave sensing portion;

providing at least one acoustic wave cover;

bonding the acoustic wave cover onto the wafer to fix the acoustic wave cover on the MEMS microphone chips without contacting the acoustic wave sensing portion;

sawing the wafer to separate the MEMS microphone chips and obtain a plurality of module units, wherein each of the module units comprises a MEMS microphone chip and an acoustic wave cover fixed on the MEMS microphone chip;

providing a substrate having a plurality of module areas, wherein each of the module areas has a connection pad;

electrically coupling the module units to the connection pads of the module areas of the substrate;

forming an encapsulant with a molding compound material to encapsulate the substrate and the module units, wherein a surface of the acoustic wave cover is exposed such that a surface of the encapsulant is along a same plane of a surface of the acoustic wave cover; and

performing a singulation process to cut the encapsulant and the substrate according to the module areas to obtain a plurality of package structures of the MEMS microphone.

14. The method of packaging the MEMS microphone as claimed in claim 13, wherein the step of bonding the acoustic wave cover onto the wafer comprises adhering or soldering process.

15. The method of packaging the MEMS microphone as claimed in claim 13, wherein the step of bonding the acoustic wave cover onto the wafer comprises heating the wafer and pressing the acoustic wave cover onto the wafer.

16. The method of packaging the MEMS microphone as claimed in claim 13, further comprising a step of providing a logic chip electrically coupled to the substrate and being encapsulated as the encapsulant is formed with the molding compound material.

17. The method of packaging the MEMS microphone as claimed in claim 16, wherein the MEMS microphone chip is stacked on the logic chip.

18. The method of packaging the MEMS microphone as claimed in claim 13, wherein the MEMS microphone chip is a system chip formed by integrating a MEMS microphone chip and a logic chip.