Hot Runner System Sensor

• US 20080085334A1
• Filed: 10/10/2006
• Published: 04/10/2008
• Est. Priority Date: 10/10/2006
• Status: Abandoned Application

• Current Assignee: Husky Injection Molding Systems Limited
• Original Assignee: Husky Injection Molding Systems Limited
• Inventors: Barnett, Daniel Wayne
• Application Number:
  US11/548,105
• Publication Number:
  US 20080085334A1
• Time in Patent Office: Days
• US Class Current: 425/110
• CPC Class Codes: B29C 2045/2722 Nozzles or runner channels provided with a pressure sensor
• CPC Class Codes: B29C 2045/274 Thermocouples or heat sensors
• CPC Class Codes: B29C 2945/76006 Pressure
• CPC Class Codes: B29C 2945/7604 Temperature
• CPC Class Codes: B29C 2945/7628 manifolds
• CPC Class Codes: B29C 45/2738 specially adapted for manifolds
• CPC Class Codes: B29C 45/77 of velocity or pressure of moulding material
• CPC Class Codes: B29C 45/78 of temperature

Abstract

A plug for use with a residual hole of a passageway in a hot runner system manifold may include an external surface for sealing with the residual hole, wherein a portion of the external surface is in direct contact with the resin in the passageway, a cavity having an internal surface that does not contact the resin, and a sensor secured to the internal surface using chemical vapor deposition, physical vapor deposition, plasma spray, or an adhesive. An ejector pin may include a sensor secured to the sidewall using chemical vapor deposition, physical vapor deposition, plasma spray, or an adhesive. A mold may include two inserts each an external surface and an internal surface defining a mold cavity. A sensing element may be secured to the external surface the first or second mold inserts wherein the sensing element does not contact the internal surface of the mold cavity.

Claims

1. A hot runner manifold system comprising:

a manifold having at least one passageway for transmitting a resin between at least one inlet and outlet, said passageway further including at least one residual hole; and

a plug including;

an external surface sized and shaped to seal with said residual hole, wherein at least a portion of said external surface is in direct contact with said resin in said passageway when said plug is disposed within said residual hole;

a cavity having an internal surface that does not contact said resin when said plug is disposed within said residual hole; and

a sensor secured to said internal surface of said cavity.

2. The hot runner manifold system as claimed in claim 1 wherein said sensor is secured to said internal surface of a sidewall of said cavity.

3. The hot runner manifold system as claimed in claim 1 wherein said sensor is secured to said internal surface of a base of said cavity.

4. The hot runner manifold system as claimed in claim 3 wherein an external surface of said base of said cavity is in direct contact with said resin in said passageway when said plug is disposed within said residual hole.

5. The hot runner manifold system as claimed in claim 1 wherein said sensing element includes a Wheatstone bridge.

6. The hot runner manifold system as claimed in claim 5 wherein said Wheatstone bridge includes a quarter bridge.

7. The hot runner manifold system as claimed in claim 5 wherein said Wheatstone bridge includes a half bridge.

8. The hot runner manifold system as claimed in claim 5 wherein said Wheatstone bridge includes a full bridge.

9. The hot runner manifold system as claimed in claim 1 wherein said sensing element is secured to said internal surface using chemical vapor deposition.

10. The hot runner manifold system as claimed in claim 1 wherein said sensing element is secured to said internal surface using physical vapor deposition.

11. The hot runner manifold system as claimed in claim 1 wherein said sensing element is secured to said internal surface using plasma spray.

12. The hot runner manifold system as claimed in claim 1 wherein said sensing element is secured to said internal surface using an adhesive.

13. The hot runner manifold system as claimed in claim 1 wherein said plug includes a shank region and a flanged region adapted to seal with said residual hole.

14. The hot runner manifold system as claimed in claim 13 wherein said shank includes an externally threaded region adapted to engage a threaded region of said residual hole.

15. A sensor for use with a hot runner system manifold having at least one passageway for the distribution of resin and at least one residual hole, said sensor comprising:

a body portion having an external surface sized and shaped to seal with said residual hole and a first and a second end portion, wherein at least a portion of said external surface of said first end portion is adapted to be in direct contact with said resin in said passageway when said plug is disposed within said residual hole;

a cavity disposed within said body portion, said cavity having an internal surface that does not contact said resin when said plug is disposed within said residual hole; and

a sensing element secured to said internal surface of said cavity.

16. The sensor as claimed in claim 15 wherein said body portion further includes a shank region, and a flanged region.

17. The sensor as claimed in claim 16 wherein said sensing element is secured to said internal surface of a base region of said cavity said shank region includes a threaded portion, wherein said threaded portion is adapted to engage a corresponding threaded portion in said residual hole in said manifold.

18. The sensor as claimed in claim 16 wherein said sensing element is secured to said internal surface of a sidewall of said cavity said sensing element includes a Wheatstone bridge.

19. The sensor as claimed in claim 16 wherein said sensing element includes a Wheatstone bridge secured to said internal surface of said cavity using a method selected from the group consisting of chemical vapor deposition, physical vapor deposition, plasma spray, and an adhesive.

20. A method of constructing a manifold for a hot runner system, said method comprising the acts of:

forming a first section of a passageway in a solid piece of material;

forming a second section of said passageway in said material, said act of forming said second section including forming a residual hole in said material; and

securing a sensor into said residual hole.

21. The method as claimed in claim 20 wherein said act of securing said sensor into said residual hole further includes the act of sealing a plug into said residual hole and securing a sensing element to an internal surface of a cavity disposed in said plug.

22. The method as claimed in claim 21 wherein said act of securing said sensing element further includes securing said sensing element using a method selected from the group consisting of chemical vapor deposition, physical vapor deposition, plasma spray, and an adhesive.

23. An ejector system comprising:

a first and a second mold plate defining a mold cavity for forming a molded part;

means for moving said at least one of said mold plates with respect to the other mold plate;

at least one ejector pin having a first and a second end disposed generally opposite from each other and a sidewall;

means contacting said first end of said at least one ejector pin for moving said at least one ejector pin from a retracted position to and extended position wherein said second end of said at least one ejector pin contacts said at least a portion of said molded part; and

at least one sensing element secured to said sidewall of said at least one ejector pin.

24. A mold comprising:

a first and a second mold insert each comprising an external surface and an internal surface, said internal surfaces defining a mold cavity configured to accept resin; and

at least one sensing element secured to said external surface of at least one of said first and said second mold inserts wherein said at least one sensing element does not contact said internal surface of said mold cavity.

25. The mold as claimed in claim 24 wherein said at least one sensing element is secured to said external surface of said at least one of said first and said second mold inserts using chemical vapor deposition, physical vapor deposition, plasma spray, or an adhesive.