Package for an Implantable Neural Stimulation Device

• US 20080086173A1
• Filed: 10/26/2007
• Published: 04/10/2008
• Est. Priority Date: 08/18/2006
• Status: Active Grant

• Current Assignee: Cortigent Incorporated
• Original Assignee: Second Sight Medical Products, Inc.
• Inventors: Greenberg, Robert, Talbot, Neil, Neysmith, Jordan, Little, James, Ok, Jerry, Dai, Rongqing, McClure, Kelly
• Granted Patent: US 8,412,339 B2
• Time in Patent Office: Days
• US Class Current: 607/2
• CPC Class Codes: A61F 15/001 Packages or dispensers for bandages, cotton balls, drapes, dressings, gauze, gowns, sheets, sponges, swabsticks or towels A61F15/007 takes precedence
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/36046 of the eye
• CPC Class Codes: A61N 1/36125 Details of circuitry or electric components
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37518 Anchoring of the implants, e.g. fixation
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/48225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/06 characterised by the material of the container or its electrical properties
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.

Claims

1. An implantable device, comprising:

an electrically non-conductive substrate;

a plurality of electrically conductive vias through said electrically non-conductive substrate;

a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains folded stack;

a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and

a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.

2. The implantable device according to claim 1, wherein said wire bonded circuit is mounted on said flip-chip circuit.

3. The implantable device according to claim 1, wherein said electrically conductive vias are a metallic and ceramic paste co-fired with said electrically non-conductive substrate to form a hermetic seal.

5. The implantable device according to claim 1, further comprising metal traces on said electrically non-conductive substrate wherein said first circuit and said second circuit are bonded to said metal traces.

6. The implantable device according to claim 5, wherein said metal traces are chosen to withstand braze temperatures.

7. The implantable device according to claim 6 wherein said metal traces comprise one or more of the metals titanium, tantalum, gold, palladium, platinum or layers or alloys thereof.

8. The implantable device according to claim 1, further comprising a flexible circuit bump bonded to said vias.

9. The implantable device according to claim 1, further comprising metal traces deposited on said electrically non-conductive substrate and in contact with said electrically conductive vias;

and a flexible circuit attached to said metal traces.

10. The implantable device according to claim 9, wherein said flexible circuit is an electrode array suitable for stimulating tissue.

11. The implantable device according to claim 1, further comprising a polymer underfill under said flip-chip circuit.

12. The implantable device according to claim 1, wherein said conductive bumps contain at least one conductive polymer.

13. The implantable device according to claim 1, wherein said conductive bumps contain at least one conductive epoxy or polyimide.

14. The implantable device according to claim 1, wherein said conductive bumps are filled with one or more metals like silver, platinum, iridium, titanium, platinum alloys, iridium alloys, or titanium alloys or mixtures thereof.

15. The implantable device according to claim 14, wherein said metal or metal alloys are in dust, flake, or powder form.

16. The implantable device according to claim 1 wherein said flip-chip circuit contains one or two stacks.

17. The implantable device according to claim 16, wherein said flip-chip circuit contains three stacks.

4. The implantable device according to claim 4, wherein said cover is brazed to said electrically non-conductive substrate.

18. A method of making an implantable device, comprising:

providing a ceramic containing non-conductive substrate defining a plurality of vias;

filling said vias with a metal containing ceramic paste;

firing said ceramic containing non-conductive substrate;

brazing a metallic ring to said ceramic containing non-conductive substrate;

bonding a first circuit to a first subset of said vias;

wire bonding a second circuit to a second subset of said vias; and

welding a metallic top to said metallic ring.