Pressure Sensing Device

• US 20080087069A1
• Filed: 09/25/2007
• Published: 04/17/2008
• Est. Priority Date: 10/03/2006
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: SensArray Corp. (KLA Corporation)
• Inventors: Mason, Aron, Wiese, Lynn, Sun, Mei, Renken, Wayne
• Granted Patent: US 7,698,952 B2
• Time in Patent Office: Days
• US Class Current: 73/1.63
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm

Abstract

At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.

Claims

1. A process condition measuring device for measuring pressure or force on a surface of a substrate undergoing a process, said device comprising:

a member having a property that is substantially the same as a property of the substrate, said member comprising a diaphragm; and

sensor means physically connected to the diaphragm, wherein said sensor means is for measuring deflection of the diaphragm when the diaphragm is in contact with and pressed against a surface employed in said process, said sensor means comprising at least one pair of capacitively coupled electrodes, wherein a capacitance of the at least one pair varies as a function of deflection of the diaphragm.

2. The device of claim 1, wherein said diaphragm is of such flexibility that deflection of said diaphragm is not more than about 10 microns when the diaphragm is in contact with and pressed against the surface employed in the process.

3. The device of claim 1, said member comprising a plate, wherein said property includes one or more of the following:

flexibility, area, hardness and physical dimensions of the plate.

4. The device of claim 1, said member comprising a base and a cover defining at least one cavity between the base and cover for housing said sensor means, said cover comprising said diaphragm.

5. The device of claim 4, wherein said at least one cavity is formed on a surface of the base facing the cover, or on a surface of the cover facing the base.

6. The device of claim 4, said member further comprising a separation layer between the base and cover, said at least one cavity being formed in said separation layer.

7. The device of claim 4, said member defines therein at least one reservoir in communication with said at least one cavity to reduce effect of deflection of the diaphragm on pressure within the at least one cavity.

8. The device of claim 7, further comprising an opening through which the at least one reservoir communicates with an external environment, and a valve controlling such communication.

9. The device of claim 4, further comprising an electronic circuit, wherein at least a portion of said electronic circuit is in said at least one cavity, the electronic circuit comprising a memory or a wireless transmission component, the electronic circuit receiving data from the sensor means and storing the data in the memory or transmitting the data using the wireless transmission component.

10. The device of claim 9, wherein said member defines therein at least one reservoir in communication with said at least one cavity to reduce effect of deflection of the diaphragm on pressure within the at least one cavity, and at least a portion of said electronic circuit is located in said at least one reservoir.

11. The device of claim 4, said member comprising a semiconductor wafer that has dimensions and thickness that are substantially the same as those of a production semiconductor wafer.

12. The device of claim 1, said process being a polishing or planarization process, said diaphragm comprising one or more of the following:

a wear resistant coating to reduce erosion by said polishing or planarization process, and additional deposited material to replace material eroded by said process.

13. The device of claim 1, said member comprising a plate, said sensor means including a plurality of pairs of capacitively coupled electrodes distributed across the areal extent of said plate, said device further comprising a plurality of temperature sensors, wherein each of the temperature sensors is located in proximity to a corresponding pair of capacitively coupled electrodes for measuring temperature of said corresponding pair of capacitively coupled electrodes, said temperature sensors providing outputs.

14. The device of claim 13, further comprising an electronic circuit responsive to said sensor means and the outputs of the temperature sensors for adjusting measurements of each of the corresponding pairs of capacitively coupled electrodes using the output of the temperature sensor located in proximity to each of the corresponding pairs.

15. The device of claim 1, further comprising at least one reference pair of capacitively coupled electrodes that is not connected to said diaphragm for sensing a parasitic capacitance in said member.

16. The device of claim 15, further comprising an electronic circuit responsive to an output of said reference pair of capacitively coupled electrodes for adjusting measurements of said sensor means to reduce effect of the parasitic capacitance on such measurements.

17. The device of claim 15, further comprising a plurality of reference pairs of capacitively coupled electrodes that are not connected to said diaphragm for sensing a parasitic capacitance in said member, each of the plurality of reference pairs located in proximity to a corresponding pair of capacitively coupled electrodes for reducing effect of the parasitic capacitance on measurements by such corresponding pair.

18. The device of claim 1, said process being a polishing or planarization process, and said member is suitable for undergoing said process to simulate behavior of said substrate in the process.

19. The device of claim 1, said process being a process for tuning a polishing or planarization head.

20. A method for measuring pressure or force on a surface of a substrate that is undergoing a process, said method comprising:

providing a device having a plate with a property that is substantially the same as a property of the substrate, said plate comprising a diaphragm and at least one pair of capacitively coupled electrodes, said at least one pair having a capacitance; and

sensing deflection of the diaphragm when the diaphragm is in contact with and pressed against a polishing or planarization surface, said sensing comprising detecting a change in the capacitance of the at least one pair of capacitively coupled electrodes.

21. The method of claim 20, wherein said property includes one or more of the following:

flexibility, area, hardness and physical dimensions of the plate, wherein said device comprises a memory or a wireless transmission component, said method further comprising storing data related to the change in the capacitance of the at least one pair of capacitively coupled electrodes in the memory or transmitting the data using the wireless transmission component.

22. The method of claim 20, further comprising measuring a parasitic capacitance in said plate and reducing effect of the parasitic capacitance on said sensing.

23. The method of claim 20, further comprising inflating an inflatable member to predetermined pressures, sensing deflection of the diaphragm caused by inflation of the member, and using heating elements to heat the plate to predetermined temperatures during the inflating and sensing.

24. The method of claim 20, said process being a polishing or planarization process, and said plate is suitable for undergoing said process to simulate behavior of said substrate in the process.

25. The method device of claim 20, said process being a process for tuning a polishing or planarization head.