LIGHTING DEVICE AND METHOD OF MAKING SAME

• US 20080089053A1
• Filed: 10/11/2007
• Published: 04/17/2008
• Est. Priority Date: 10/12/2006
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: LED Lighting Fixtures, Inc. (Wolfspeed, Inc.)
• Inventors: Negley, Gerald
• Granted Patent: US 8,994,045 B2
• Time in Patent Office: Days
• US Class Current: 362/84
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

A lighting device comprising a light emitter chip, a reflective cup and a lumiphor positioned between the chip and the cup. Also, a lighting device comprising a light emitter chip, a wire bonded to a first surface of the chip and a lumiphor which faces a second surface of the chip. Also, a lighting device comprising a light emitter chip, and a lumiphor, a first surface of the chip facing a first region of the lumiphor, a second surface of the chip facing a second region of the lumiphor. Also, a lighting device comprising a light emitter chip and first and second lumiphors, a first surface of the chip facing the second lumiphor, a second surface of the chip facing the first lumiphor. Also, methods of making lighting devices.

Claims

1. A lighting device comprising:

at least a first solid state light emitter chip;

at least a first reflective cup; and

at least a first lumiphor, said first lumiphor being positioned between said first solid state light emitter chip and said first reflective cup.

2. A lighting device as recited in claim 1, further comprising at least a second lumiphor, said first solid state light emitter chip comprising at least a first solid state light emitter chip first surface and a first solid state light emitter chip second surface, said first solid state light emitter chip first surface facing said second lumiphor, said first solid state light emitter chip second surface facing said first lumiphor.

3. A lighting device as recited in claim 2, wherein said second lumiphor is spaced from said first solid state light emitter chip first surface.

4. A lighting device as recited in claim 2, wherein said first solid state light emitter chip second surface is in contact with said first lumiphor.

5. A lighting device as recited in claim 1, wherein said first lumiphor comprises a first lumiphor first surface and a first lumiphor second surface, and said first lumiphor second surface is in contact with said reflective cup.

6. A lighting device as recited in claim 1, wherein said first lumiphor comprises a first lumiphor first surface and a first lumiphor second surface, said first lumiphor second surface being in contact with said reflective cup, said first lumiphor first surface being in contact with said first solid state light emitter chip second surface.

7. A lighting device as recited in claim 6, wherein said lighting device further comprises at least a second lumiphor, said first solid state light emitter chip first surface facing said second lumiphor.

8. A lighting device as recited in claim 7, wherein said second lumiphor is spaced from said first solid state light emitter chip first surface.

9. A lighting device comprising:

at least a first solid state light emitter chip, said first solid state light emitter chip comprising at least a first solid state light emitter chip first surface and a first solid state light emitter chip second surface;

at least one wire bonded to said first solid state light emitter chip first surface; and

at least a first lumiphor,

said first solid state light emitter chip second surface facing said first lumiphor.

10. A lighting device as recited in claim 9, wherein said first solid state light emitter chip second surface is in contact with said first lumiphor.

11. A lighting device as recited in claim 9, further comprising at least a second lumiphor, said first solid state light emitter chip first surface facing said second lumiphor.

12. A lighting device as recited in claim 11, wherein said second lumiphor is spaced from said first solid state light emitter chip first surface.

13. A lighting device as recited in claim 9, further comprising a reflective cup, said first lumiphor comprising a first lumiphor first surface and a first lumiphor second surface, said first lumiphor second surface being in contact with said reflective cup, said first lumiphor first surface being in contact with said first solid state light emitter chip second surface.

14. A lighting device comprising:

at least a first solid state light emitter chip, said first solid state light emitter chip comprising at least a first solid state light emitter chip first surface and a first solid state light emitter chip second surface; and

at least a first lumiphor,

said first solid state light emitter chip first surface facing a first region of said first lumiphor, said first solid state light emitter chip second surface facing a second region of said first lumiphor.

15. A lighting device as recited in claim 14, wherein said first lumiphor is spaced from said first solid state light emitter chip first surface.

16. A lighting device as recited in claim 14, further comprising a reflective cup, said reflective cup being in contact with a third region of said first lumiphor.

17. A lighting device as recited in claim 14, further comprising a reflective cup, said reflective cup being in contact with a third region of said first lumiphor, said first solid state light emitter chip second surface being in contact with said second region of said first lumiphor.

18. A lighting device as recited in claim 14, wherein said first lumiphor surrounds said first solid state light emitter chip.

19. A lighting device as recited in claim 18, wherein said first solid state light emitter chip comprises at least a first solid state light emitter chip first surface and a first solid state light emitter chip second surface, and said first solid state light emitter chip second surface is in contact with said first lumiphor.

20. A lighting device as recited in claim 18, further comprising a reflective cup, said first lumiphor comprising at least a first lumiphor first surface and a first lumiphor second surface, said first lumiphor second surface being in contact with said reflective cup.

21. A lighting device comprising:

at least a first solid state light emitter chip, said first solid state light emitter chip comprising at least a first solid state light emitter chip first surface and a first solid state light emitter chip second surface;

at least first and second lumiphors,

said first solid state light emitter chip first surface facing said second lumiphor, said first solid state light emitter chip second surface facing said first lumiphor.

22. A lighting device as recited in claim 21, wherein said second lumiphor is spaced from said first solid state light emitter chip first surface.

23. A lighting device as recited in claim 21, wherein said first solid state light emitter chip second surface is in contact with said first lumiphor.

24. A lighting device as recited in claim 21, further comprising a reflective cup, said first lumiphor comprising at least a first lumiphor first surface and a first lumiphor second surface, said first lumiphor second surface being in contact with said reflective cup.

25. A lighting device as recited in claim 21, further comprising a reflective cup, said first lumiphor comprising a first lumiphor first surface and a first lumiphor second surface, said first lumiphor second surface being in contact with said reflective cup, said first lumiphor first surface being in contact with said first solid state light emitter chip second surface.

26. A method of making a lighting device, the method comprising:

positioning a first lumiphor in a reflective cup;

positioning at least a first solid state light emitter chip such that said first lumiphor is between said reflective cup and said first solid state light emitter chip, and a second surface of said first solid state light emitter chip is in contact with said first lumiphor; and

positioning at least a second lumiphor such that a first surface of said solid state light emitter chip faces said second lumiphor, said first solid state light emitter chip first surface and said first solid state light emitter chip second surface being on opposite sides of said first solid state light emitter chip.

27. A method of making a lighting device, said method comprising:

positioning a first lumiphor in a reflective cup; and

positioning at least a first solid state light emitter chip such that said first lumiphor is between said reflective cup and said first solid state light emitter chip.

28. A method of making a lighting device, said method comprising:

positioning at least a first solid state light emitter chip such that a second surface of said solid state light emitter chip faces a first lumiphor; and

bonding at least one wire to a first surface of said first solid state light emitter chip.

29. A method as recited in claim 28, further comprising positioning said first lumiphor in a reflective cup prior to said positioning at least a first solid state light emitter chip.

30. A method of making a lighting device, said method comprising:

positioning at least a first solid state light emitter chip such that a second surface of said solid state light emitter chip faces a first portion of a first lumiphor and a first surface of said solid state light emitter chip faces a second portion of said first lumiphor.

31. A method as recited in claim 30, further comprising positioning said first lumiphor in a reflective cup prior to said positioning at least a first solid state light emitter chip.

32. A method of making a lighting device, said method comprising:

positioning at least a first solid state light emitter chip such that a second surface of said solid state light emitter chip faces a first lumiphor;

positioning at least a second lumiphor such that a first surface of said solid state light emitter chip faces said second lumiphor.

33. A method as recited in claim 32, further comprising positioning said first lumiphor in a reflective cup prior to said positioning at least a first solid state light emitter chip.