High Power Light Emitting Diode Package

• US 20080089072A1
• Filed: 03/23/2007
• Published: 04/17/2008
• Est. Priority Date: 10/11/2006
• Status: Abandoned Application

• Current Assignee: Alti-Electronics Co., Ltd. (KD Corp.)
• Original Assignee: Alti-Electronics Co., Ltd. (KD Corp.)
• Inventors: Kim, Dong Soo, Kim, Dong-Sel
• Application Number:
  US11/690,192
• Publication Number:
  US 20080089072A1
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A high power light emitting diode (“LED”) package is disclosed. The high power LED package includes a housing made of an insulating material and having a cavity in its central portion; a lead frame made of a conductive material, including an inner lead exposed by the cavity of the housing and an outer lead extending outside the housing; a heat sink above which the inner lead is placed and having a portion exposed by the cavity of the housing; an LED chip mounted on the exposed portion of the heat sink and electrically connected to the inner lead; a lens portion coupled to the housing to cover the cavity of the housing; and an insulating adhesive sheet interposed between the inner lead and the heat sink for electrically insulating and thermally coupling the inner lead and the heat sink.

Claims

1. A high power light emitting diode (“

LED”

) package, comprising;

a housing made of an insulating material and having a cavity in its central portion;

a lead frame made of a conductive material, including an inner lead exposed by the cavity of the housing and an outer lead extending outside the housing;

a heat sink above which the inner lead is placed and having a portion exposed by the cavity of the housing;

an LED chip mounted on the exposed portion of the heat sink and electrically connected to the inner lead;

a lens portion coupled to the housing to cover the cavity of the housing; and

an insulating adhesive sheet interposed between the inner lead and the heat sink for electrically insulating and thermally coupling the inner lead and the heat sink.

2. The high power LED package of claim 1, wherein the insulating adhesive sheet comprises a base film made of an insulating material and adhesive layers arranged on a top and a bottom of the base film.

3. The high power LED package of claim 2, wherein the base film is a polyimide film having a glass transition temperature of more than 260°

C.

4. The high power LED package of claim 2, wherein the adhesive layers are formed by coating a polyimide-like adhesive containing an acid terminal group.

5. The high power LED package of claim 2, wherein a filler having thermal conductivity and non conductivity is added in the base film and the adhesive layers.

6. The high power LED package of claim 5, wherein the filler comprises one of silica, alumina, and aluminum nitride (AlN).

7. The high power LED package of claim 1, wherein the LED chip is adhered to the exposed portion of the heat sink by using a non-conductive paste.

8. The high power LED package of claim 1, wherein the lens portion comprises a molding portion which is formed by filling insulating resin in the cavity of the housing to seal the LED chip and a lens for covering the molding portion.

9. The high power LED package of claim 8, wherein the molding portion contains a phosphor corresponding to a color of light emitted from the LED chip.

10. The high power LED package of claim 1, wherein the LED chip is electrically connected to the inner lead by using a wire bonding or a flip chip bonding.

11. The high power LED package of claim 1, wherein the cavity of the housing has a cup shape whose diameter is increased as it is higher.

12. The high power LED package of claim 11, wherein a reflecting material is coated on or a reflector made of a metallic material is coupled to an inner side of the cavity of the housing.

13. The high power LED package of claim 1, wherein the housing has a Zener diode mounting portion in which a Zener diode is mounted.

14. A light emitting diode (“

LED”

) package, comprising;

a housing including an LED chip mounting portion, lead frame contact portions for electrical contact with an LED chip, a Zener diode mounting portion, a lead frame connecting portion formed on its side, and a heat sink adhering portion, wherein the lead frame connecting portion and the heat sink adhering portion have a cavity;

a lead frame coupled through the lead frame connecting portion;

a heat sink adhered through the heat sink adhering portion; and

an insulating adhesive sheet for adhering the lead frame and the heat sink.

15. The LED package of claim 14, wherein the LED chip mounting portion has a concave shape whose diameter is smaller as it is lower.

16. The LED package of claim 14, wherein the lead frame contact portion and the Zener diode mounting portion are patterned into one area.

17. The LED package of claim 14, wherein the LED chip is electrically connected through its bottom portion.