PROCESS FOR IMPROVING DESIGN-LIMITED YIELD BY LOCALIZING POTENTIAL FAULTS FROM PRODUCTION TEST DATA
6 Assignments
0 Petitions
Accused Products
Abstract
A process for improving design-limited yield by collecting test fail data, converting to electrical faults, and localizing to physical area on semiconductor die. The steps of identifying an area on a wafer containing a fault to enable the analysis of specific defects, accumulating data suitable for yield monitoring analysis based on pattern test failures logged on scan cells in scan chains on automatic test equipment, and translating scan cell and scan chain failure reports to geometric locations of electrical structures on wafers.
55 Citations
16 Claims
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1. (canceled)
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2. (canceled)
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3. (canceled)
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4. (canceled)
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5. A method for classifying faults into the following classes “
- RAW STUCK”
, “
UNRESOLVED BROKEN CHAIN”
, “
RESOLVED BROKEN CHAIN”
, “
RAW DELAY”
, “
PATH DELAY”
, comprising the steps ofapplying a chain integrity test pattern; analyzing a chain integrity test pattern data log; applying a stuck test pattern; applying an AC-scan test pattern; analyzing an AC-scan test pattern data log; and identifying a path delay fault.
- RAW STUCK”
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6. A method for localizing faults to within a detailed circuit description comprising the steps of:
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classifying a fault; translating a fault location from scan chain-bit position to a logical design name for a scan cell; tracing components attached to a scan cell; and reading a list of origins and dimensions of components and wires connecting said components. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for reporting the physical area containing an electrically detected fault recorded on semiconductor test equipment apparatus to a computer-implemented yield management utility software program product comprising the following steps:
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localizing faults to within a detailed circuit description; and exporting X/Y Die Coordinate on Wafer, X/Y Origin on Die, X size, Y size, Area (X*Y) and Classification.
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16. A method for displaying the geometric location of potential defect locations with circuit details corresponding to a fault, graphically on a computer-attached display apparatus comprising the following steps:
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adjusting the width of a line representing a wire to be visible on the display; computing a scaling factor to fully show on the display the geometric location of potential defect locations on a die on a wafer; displaying each component on a list of potential defect locations in scaled origin, width, and length; and displaying the adjusted lines representing wires on the list of potential defect locations.
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Specification