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PULSE PLATING OF A LOW STRESS FILM ON A SOLAR CELL SUBSTRATE

  • US 20080092947A1
  • Filed: 10/24/2006
  • Published: 04/24/2008
  • Est. Priority Date: 10/24/2006
  • Status: Abandoned Application
First Claim
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1. A method for forming a metal interconnect in a solar cell substrate, comprising:

  • providing a substrate that has either an n-type region or a p-type region generally adjacent to a surface of a substrate;

    forming a seed layer that is in electrical communication with the n-type region or the p-type region on the surface of the substrate; and

    forming a first metal layer over the seed layer by immersing the seed layer and an electrode in a first electrolyte and biasing the seed layer relative to the electrode using one or more waveforms delivered from a power supply.

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