MEM switching device and method for making same

• US 20080093691A1
• Filed: 12/12/2007
• Published: 04/24/2008
• Est. Priority Date: 10/22/2002
• Status: Abandoned Application

• Current Assignee: Cabot Microelectronics Corporation (Entegris Incorporated)
• Original Assignee: Cabot Microelectronics Corporation (Entegris Incorporated)
• Inventors: Busta, Heinz
• Application Number:
  US12/001,567
• Publication Number:
  US 20080093691A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2001/0063 having electrostatic latches, i.e. the activated position is kept by electrostatic forces other than the activation force
• CPC Class Codes: H01H 2001/0084 with perpendicular movement of the movable contact relative to the substrate
• CPC Class Codes: H01H 2001/0089 Providing protection of elements to be released by etching of sacrificial element; Avoiding stiction problems, e.g. of movable element to substrate

Abstract

A MEM device and method for fabricating a MEM device. A MEM device comprising a lever mechanism residing along a substrate is disclosed. A contact material is deposited on a first surface of the lever mechanism. In one arrangement, the first surface is disposed towards the substrate. A first contact region may be deposited on the substrate. The first contact region attracts the lever mechanism towards the substrate such that the contact material becomes operationally coupled to a second contact region. The MEM device may also comprise a first anchor portion and a second anchor portion. The first and second anchor portions may be integral to a top surface of the substrate. Aspects of the invention are also particularly useful in providing an encapsulated MEM switching device.

Claims

1. A MEM switching device comprising:

(a) a rib enforced lever mechanism residing along a surface of a substrate, said lever mechanism having at least one anchor lever mechanism portion extending from said surface;

(b) a first contact region deposited on said substrate, said first contact energized for attracting said lever mechanism towards said substrate such that said lever mechanism becomes electrically coupled to a third contact region; and

(c) a second contact region that pulls back said lever mechanism from being electrically coupled to said third contact region.

2. The invention of claim 1 wherein said rib enforced lever mechanism comprises a rib that is integral to said lever mechanism.

3. The invention of claim 2 wherein said rib comprises a conductive layer.

4. The invention of claim 2 wherein said conductive layer comprises Copper.

5. The invention of claim 3 wherein said conductive layer comprises Diamond.

6. The invention of claim 3 wherein said conductive layer comprises a conductive composition.

7. The invention of claim 1 wherein said switching device comprises a planarized surface.

8. The invention of claim 5 wherein said planarized surface is planarized by a Chemical Mechanical Planarization process.

9. The invention of claim 1 further comprising an integral enclosure, said integral enclosure used to enclose said MEM device.

10. The invention of claim 1 wherein said third contact region comprises a first and a second micro-strip line.

11. A micro-machined structure for enclosing at least one MEM device, said structure comprising:

(a) a structure extending from a substrate and at least partially enclosing said at least one MEM device; and

(b) a cover structure residing on a portion of said substrate structure, wherein said micro-machined structure defines at least one tortuous path.

12. The invention of claim 11 wherein said tortuous path provides for a removal of material residing along said surface.

13. The invention of claim 11 further comprising a contact region, said contact region provided on said cover substrate structure, said contact region acting as a pull-back contact for a MEM device residing on said substrate.

14. The invention of claim 13 wherein said contact region comprises a shielding member, said shielding member preventing passage of electromagnetic radiation.

15. A method of fabricating a micro-machined apparatus, said method comprising the steps of:

(a) providing a substrate;

(b) fabricating a substrate structure, said substrate structure extending from said substrate; and

(c) fabricating a cover substrate structure residing on a portion of said substrate structure, said cover structure defining at least one tortuous channel.